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FDD4N60NZ

Onsemi

FDD4N60NZ by Onsemi

FDD4N60NZ by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 13.6A and EAS of 179.2mJ, operating in ENHANCEMENT MODE with a Drain-Source On Resistance of 2.5 ohm.

Median Price

$0.588

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 36,353 parts In-Stock

1+ parts

-

100+ parts

$0.481

1k+ parts

$0.399

10k+ parts

$0.356

36,353

-

$0.481

$0.399

$0.356

Arrow

USA . 12,500 parts In-Stock

1+ parts

-

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10k+ parts

$0.804

12,500

-

-

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$0.804

Verical

USA . 12,483 parts In-Stock

1+ parts

-

100+ parts

$0.422

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-

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12,483

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$0.422

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Farnell

UK . 2,500 parts In-Stock

1+ parts

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100+ parts

$0.694

1k+ parts

$0.459

10k+ parts

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2,500

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$0.694

$0.459

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Distributors (In-Stock)

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Digiode

USA . 2,448 parts In-Stock

1+ parts

$0.392

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2,448

$0.392

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Demsay Elektronik

Türkiye . 88,000 parts In-Stock

1+ parts

$0.429

100+ parts

$0.429

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$0.429

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-

88,000

$0.429

$0.429

$0.429

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.525

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10

$0.525

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Chip Stock

USA . 48,000 parts In-Stock

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48,000

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Vyrian

USA . 14,678 parts In-Stock

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14,678

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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2,500

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Flip Electronics

USA . 2,500 parts In-Stock

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J2 Sourcing AB

Sweden . 1,002 parts In-Stock

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1,002

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14,535 parts In-Stock

1+ parts

$0.351

100+ parts

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14,535

$0.351

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Semicontronic

India . 14,512 parts In-Stock

1+ parts

$0.351

100+ parts

$0.342

1k+ parts

$0.340

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14,512

$0.351

$0.342

$0.340

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Corphita

USA . 1,921 parts In-Stock

1+ parts

$0.372

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1,921

$0.372

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Corohmni

South Africa . 80 parts In-Stock

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$0.413

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80

$0.413

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.514

100+ parts

-

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$0.494

10k+ parts

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1,000

$0.514

-

$0.494

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Argo Parts USA

USA . 427 parts In-Stock

1+ parts

$0.525

100+ parts

-

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10k+ parts

$0.509

427

$0.525

-

-

$0.509

Continental Prestige Electronics

USA . 2,500 parts In-Stock

1+ parts

$0.988

100+ parts

$0.694

1k+ parts

-

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2,500

$0.988

$0.694

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Aztec Data Supply Inc.

USA . 1,658 parts In-Stock

1+ parts

$1.597

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1,658

$1.597

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Perfect Parts

USA . 77,973 parts In-Stock

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Futuretech Components

Singapore . 50,000 parts In-Stock

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GreenTree Electronics

Israel . 8,204 parts In-Stock

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Problanco Electronics

Mexico . 5,400 parts In-Stock

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Kulean Microsystems

USA . 5,071 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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iodParts Technologies Inc.

India . 2,500 parts In-Stock

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Supply Digital

USA . 1,553 parts In-Stock

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SupplyDigital Components

Austria . 1,056 parts In-Stock

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UHIMA Technologies

Türkiye . 327 parts In-Stock

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327

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Microchip USA

USA . 318 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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TANS Electronics

Latvia . 102 parts In-Stock

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Overview

Upgrade your power systems with the FDD4N60NZ from Onsemi! Crafted with precision and expertise, this N-channel power field effect transistor is designed to deliver reliable performance in switching applications. With a robust construction and high breakdown voltage of 600V, this transistor offers enhanced efficiency and durability. Whether you're looking to enhance the performance of your industrial machinery or automotive electronics, the FDD4N60NZ is the ideal solution. Trust Onsemi for quality products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer high efficiency and fast switching speeds, making this product suitable for high-performance electronic devices.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the transistor from voltage spikes, increasing its longevity and reliability in switching applications.

Transistor Application: SWITCHING

Specifically designed for switching applications, this transistor offers efficient power management and control in electronic systems.

Surface Mount: YES

With surface mount capability, this transistor is easy to integrate into compact circuit designs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage allows this transistor to handle high voltage applications, making it a versatile choice for various power management tasks.

Package Shape: RECTANGULAR

The rectangular shape of the package enables easy mounting on PCBs and enhances heat dissipation, ensuring optimal performance in demanding environments.

Terminal Form: GULL WING

The gull wing terminals provide secure connections and facilitate soldering, contributing to the overall reliability and stability of the transistor.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers enhanced control and efficiency, making this transistor ideal for precision switching applications.

Maximum Pulsed Drain Current (IDM): 13.6 A

The high pulsed drain current rating allows the transistor to handle peak power loads, ensuring reliable operation in transient conditions.

Avalanche Energy Rating (EAS): 179.2 mJ

The high avalanche energy rating indicates the transistor's ability to withstand energy spikes, making it a robust choice for rugged applications.

Maximum Drain Current (Abs) (ID): 3.4 A

This transistor can handle high drain currents continuously, ensuring stable performance in power management applications.

No. of Terminals: 2

The two terminals simplify the integration of this transistor into circuit designs, making it a convenient choice for various electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) FDD4N60NZ attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

179.2 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

3.4 A

Maximum Drain Current (ID):

3.4 A

Maximum Drain-Source On Resistance:

2.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

13.6 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD4N60NZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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