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NTF2N08L

Onsemi

NTF2N08L by Onsemi

NTF2N08L by Onsemi is a single N-channel power FET for switching applications. It features a min DS breakdown voltage of 80V, operates in enhancement mode, and has a Gull Wing terminal form. This MOSFET is designed for surface mount with a small outline package style, making it suitable for various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

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Kulean Microsystems

USA . 6,752 parts In-Stock

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TANS Electronics

Latvia . 2,676 parts In-Stock

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Problanco Electronics

Mexico . 1,993 parts In-Stock

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Corphita

USA . 925 parts In-Stock

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UHIMA Technologies

Türkiye . 548 parts In-Stock

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Corohmni

South Africa . 493 parts In-Stock

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SupplyDigital Components

Austria . 19 parts In-Stock

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Overview

Looking for a reliable and high-quality Power Field Effect Transistor (FET)? Look no further than the NTF2N08L by Onsemi! With its N-CHANNEL configuration and ENHANCEMENT MODE operating mode, this transistor is perfect for switching applications. Its 80V minimum DS breakdown voltage ensures durability and reliability. Onsemi's reputation for excellence in semiconductor technology guarantees top-notch performance. Trust the NTF2N08L to deliver exceptional value and benefits for all your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the FET, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE

A single configuration simplifies the circuit design and reduces complexity, making the FET easier to integrate into a system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and low power consumption, making it ideal for efficient power management.

Surface Mount: YES

Surface mount technology allows for easy and secure mounting on circuit boards, saving space and providing improved thermal characteristics.

Minimum DS Breakdown Voltage: 80 V

With a high breakdown voltage, this FET can handle higher power levels without risk of damage, ensuring reliable operation in demanding conditions.

Package Shape: RECTANGULAR

The rectangular shape of the package offers efficient use of board space and facilitates easy placement and soldering during assembly.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching operation, allowing for precise regulation of power flow in the circuit.

No. of Terminals: 4

Having 4 terminals provides flexibility in circuit design and allows for additional connections or features to be implemented as needed.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and enables high-density mounting, making it suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-state resistance, resulting in efficient power management and minimal heat dissipation.

Transistor Element Material: SILICON

Silicon-based transistors are known for their reliability and robustness, ensuring long-term performance and stability of the FET.

Terminal Finish: TIN LEAD

Tin lead finish ensures good solderability and corrosion resistance, maintaining the integrity of the connections over time.

Terminal Position: DUAL

Dual terminal position offers versatility in mounting orientation, allowing for easy integration into various circuit configurations.

Case Connection: DRAIN

Drain connection provides a reliable path for the controlled current flow, ensuring efficient power transfer and proper functioning of the FET.

Technical Specifications

Power Field Effect Transistors (FET) NTF2N08L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

80 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTF2N08L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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