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FDB390N15A

Onsemi

FDB390N15A by Onsemi

FDB390N15A by Onsemi is a N-CHANNEL Power FET with 150V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 108A IDM, 78mJ EAS, and 0.039 ohm RDS(on). Operating at up to 175°C, it comes in a SMALL OUTLINE package with GULL WING terminals.

Median Price

$2.057

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,843 parts In-Stock

1+ parts

$2.890

100+ parts

$1.289

1k+ parts

$0.986

10k+ parts

$0.870

2,843

$2.890

$1.289

$0.986

$0.870

Mouser Electronics

USA . 709 parts In-Stock

1+ parts

$2.890

100+ parts

$1.290

1k+ parts

$0.994

10k+ parts

-

709

$2.890

$1.290

$0.994

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Rochester

USA . 7,007 parts In-Stock

1+ parts

-

100+ parts

$1.180

1k+ parts

$0.979

10k+ parts

$0.873

7,007

-

$1.180

$0.979

$0.873

Verical

USA . 6,400 parts In-Stock

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$1.224

10k+ parts

$1.091

6,400

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-

$1.224

$1.091

Distributors (In-Stock)

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Digiode

USA . 1,411 parts In-Stock

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$0.918

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1,411

$0.918

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Vyrian

USA . 3,067 parts In-Stock

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$0.966

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3,067

$0.966

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Flip Electronics

USA . 4,800 parts In-Stock

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4,800

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J2 Sourcing AB

Sweden . 120 parts In-Stock

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120

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Corphita

USA . 2,034 parts In-Stock

1+ parts

$0.869

100+ parts

-

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2,034

$0.869

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Corohmni

South Africa . 135 parts In-Stock

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$0.966

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135

$0.966

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Component Stockers USA

USA . 13,094 parts In-Stock

1+ parts

$0.980

100+ parts

$0.920

1k+ parts

$0.830

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13,094

$0.980

$0.920

$0.830

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Microchip USA

USA . 8,075 parts In-Stock

1+ parts

$8.390

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8,075

$8.390

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Kepictronics

USA . 10,065 parts In-Stock

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Problanco Electronics

Mexico . 8,134 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,163 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,775 parts In-Stock

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Lixinc

USA . 3,498 parts In-Stock

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Perfect Parts

USA . 3,121 parts In-Stock

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Kulean Microsystems

USA . 2,339 parts In-Stock

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Supply Digital

USA . 1,981 parts In-Stock

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TANS Electronics

Latvia . 1,166 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Native Components

USA . 520 parts In-Stock

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$4.530

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520

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$4.530

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SupplyDigital Components

Austria . 357 parts In-Stock

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357

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UHIMA Technologies

Türkiye . 290 parts In-Stock

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Northwest PG Solutions

USA . 247 parts In-Stock

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$4.577

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Overview

Discover the unparalleled performance of the FDB390N15A by Onsemi, a top-tier manufacturer known for delivering quality electronic components. This N-CHANNEL Power Field Effect Transistor (FET) is designed for SWITCHING applications, featuring a SINGLE configuration with a built-in diode for enhanced functionality. With a high DS Breakdown Voltage of 150V and a low on-resistance of 0.039 ohm, this transistor ensures efficient power management in various electronic devices. Trust in Onsemi's expertise and experience to provide you with reliable and cutting-edge components that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and higher switching speeds compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects against reverse current flow.

Transistor Application: SWITCHING

Designed for high-speed switching applications, making it suitable for power control in various electronic devices.

Surface Mount: YES

Surface mount design enables easy and efficient PCB assembly.

Minimum DS Breakdown Voltage: 150 V

High breakdown voltage ensures reliability and durability in power switching applications.

Maximum Pulsed Drain Current (IDM): 108 A

Capable of handling high peak currents, making it suitable for applications with pulsed loads.

Avalanche Energy Rating (EAS): 78 mJ

High avalanche energy rating indicates robustness and ability to withstand transient voltage spikes.

Maximum Power Dissipation (Abs): 75 W

With a high power dissipation rating, the FET can handle significant power without overheating.

Maximum Operating Temperature: 175 °C

Can function reliably at elevated temperatures, suitable for industrial and automotive applications.

Maximum Drain-Source On Resistance: 0.039 ohm

Low on-resistance minimizes power loss and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FDB390N15A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

78 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.039 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

108 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDB390N15A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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