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FDB3672-F085

Onsemi

FDB3672-F085 by Onsemi

FDB3672-F085 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 44A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, operates in ENHANCEMENT MODE, and has a low 0.047 ohm On Resistance.

Median Price

$2.711

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$2.192

100+ parts

$1.995

1k+ parts

$1.797

10k+ parts

-

3,000

$2.192

$1.995

$1.797

-

DigiKey

USA . 296 parts In-Stock

1+ parts

$3.230

100+ parts

$1.465

1k+ parts

-

10k+ parts

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296

$3.230

$1.465

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,896 parts In-Stock

1+ parts

$2.082

100+ parts

-

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1,896

$2.082

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Vyrian

USA . 941 parts In-Stock

1+ parts

$2.192

100+ parts

-

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941

$2.192

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Distributors (Availability)

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Corphita

USA . 2,614 parts In-Stock

1+ parts

$1.973

100+ parts

-

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2,614

$1.973

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$2.192

100+ parts

$1.995

1k+ parts

$1.797

10k+ parts

-

3,000

$2.192

$1.995

$1.797

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Corohmni

South Africa . 72 parts In-Stock

1+ parts

$2.192

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-

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72

$2.192

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Native Components

USA . 32 parts In-Stock

1+ parts

$5.250

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-

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32

$5.250

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 20,526 parts In-Stock

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Microchip USA

USA . 7,189 parts In-Stock

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7,189

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Kulean Microsystems

USA . 5,956 parts In-Stock

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5,956

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SupplyDigital Components

Austria . 5,931 parts In-Stock

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5,931

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TANS Electronics

Latvia . 4,713 parts In-Stock

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4,713

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Problanco Electronics

Mexico . 3,281 parts In-Stock

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3,281

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GreenTree Electronics

Israel . 3,200 parts In-Stock

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3,200

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Perfect Parts

USA . 2,688 parts In-Stock

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2,688

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Supply Digital

USA . 1,342 parts In-Stock

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1,342

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 966 parts In-Stock

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966

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Northwest PG Solutions

USA . 265 parts In-Stock

1+ parts

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$5.145

10k+ parts

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265

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$5.145

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Overview

Unlock the power of innovation with the FDB3672-F085 by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor is a game-changer in the world of switching applications. With a maximum drain current of 44A and a minimum DS breakdown voltage of 100V, this transistor offers unrivaled performance and reliability. Its small outline package shape and gull wing terminal form make it easy to integrate into any project. Experience enhanced efficiency and productivity with the FDB3672-F085, where quality meets excellence. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the FET, ensuring reliability and durability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON-resistance and higher mobility, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, preventing damage to the FET and other connected components.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast and efficient switching capabilities for various electronic circuits.

Avalanche Energy Rating (EAS): 120 mJ

With a high avalanche energy rating, this FET can withstand sudden voltage spikes or surges without failing, ensuring reliability in transient conditions.

Maximum Power Dissipation (Abs): 120 W

The high power dissipation capability enables this FET to handle higher power loads without overheating, making it suitable for demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers good performance characteristics such as low ON-resistance and high switching speeds, making the FET efficient in power management.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate reliably in harsh environmental conditions without compromising performance.

Maximum Drain-Source On Resistance: 0.047 ohm

The low ON-resistance of this FET reduces power losses and improves efficiency in switching applications, resulting in better overall performance.

Technical Specifications

Power Field Effect Transistors (FET) FDB3672-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

44 A

Maximum Drain Current (ID):

7.2 A

Maximum Drain-Source On Resistance:

.047 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDB3672-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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