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NTB60N06T4

Onsemi

NTB60N06T4 by Onsemi

NTB60N06T4 by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 180A IDM, and 0.014 ohm RDS(on). Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE at up to 175 °C, making it suitable for high-power tasks.

Median Price

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< 1k

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Vyrian

USA . 598 parts In-Stock

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Digiode

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Kepictronics

USA . 20,000 parts In-Stock

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Kulean Microsystems

USA . 7,508 parts In-Stock

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SupplyDigital Components

Austria . 6,299 parts In-Stock

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TANS Electronics

Latvia . 2,088 parts In-Stock

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Problanco Electronics

Mexico . 2,023 parts In-Stock

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Corphita

USA . 1,002 parts In-Stock

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UHIMA Technologies

Türkiye . 418 parts In-Stock

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Corohmni

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Overview

Unleash the power of innovation with Onsemi's NTB60N06T4 Power Field Effect Transistor. Designed for switching applications, this N-channel transistor offers unparalleled performance with a maximum drain current of 60A and a low on-resistance of 0.014 ohm. With a robust construction and built-in diode, this transistor is highly reliable and efficient. Whether you're looking to enhance your electronic designs or boost your system's capabilities, the NTB60N06T4 is the perfect choice. Trust in Onsemi's quality and expertise to take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, increasing the overall lifespan of the product.

Polarity or Channel Type: N-CHANNEL

Offers efficient control of the current flow in the circuit, making it suitable for various applications requiring N-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and reduces the need for additional components, saving space and cost.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in tasks that require rapid on/off switching.

Surface Mount: YES

Suitable for automated assembly processes and compact designs, making it easy to integrate into different electronic systems.

Operating Mode: ENHANCEMENT MODE

Provides high efficiency and control over the power flow, enhancing the overall performance of the transistor.

Maximum Pulsed Drain Current (IDM): 180 A

Capable of handling high current loads during peak operation, ensuring stability and reliability in demanding conditions.

Avalanche Energy Rating (EAS): 454 mJ

Offers protection against voltage spikes and transients, safeguarding the transistor and connected components from damage.

Maximum Power Dissipation (Abs): 150 W

Can handle high power dissipation without overheating, allowing for continuous operation without risk of thermal damage.

Maximum Operating Temperature: 175 °C

Operates reliably at high temperatures, making it suitable for applications where heat dissipation is a concern.

Maximum Drain-Source On Resistance: 0.014 ohm

Provides low resistance for efficient power flow, resulting in reduced power loss and improved overall efficiency.

Technical Specifications

Power Field Effect Transistors (FET) NTB60N06T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

454 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

180 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB60N06T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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