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NTB6412ANT4G

Onsemi

NTB6412ANT4G by Onsemi

NTB6412ANT4G by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, 240A IDM, and 0.0182 ohm RDS(on). It is used in applications requiring high power dissipation up to 167W, such as power supplies and motor control systems.

Median Price

$1.425

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 291 parts In-Stock

1+ parts

$4.460

100+ parts

$2.920

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-

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291

$4.460

$2.920

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Rochester

USA . 1,169 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.140

10k+ parts

$1.070

1,169

-

$1.270

$1.140

$1.070

Verical

USA . 1,169 parts In-Stock

1+ parts

-

100+ parts

-

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$1.425

10k+ parts

$1.337

1,169

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-

$1.425

$1.337

Distributors (In-Stock)

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Digiode

USA . 1,251 parts In-Stock

1+ parts

$1.349

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1,251

$1.349

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Vyrian

USA . 3,161 parts In-Stock

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R&J Components

USA . 373 parts In-Stock

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373

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Distributors (Availability)

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Component Stockers USA

USA . 3,901 parts In-Stock

1+ parts

$0.980

100+ parts

$0.930

1k+ parts

$0.900

10k+ parts

-

3,901

$0.980

$0.930

$0.900

-

Corphita

USA . 429 parts In-Stock

1+ parts

$1.278

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429

$1.278

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Corohmni

South Africa . 87 parts In-Stock

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$1.420

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87

$1.420

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Microchip USA

USA . 254 parts In-Stock

1+ parts

$8.840

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254

$8.840

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AZTECH Wire

Italy . 646 parts In-Stock

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$20.690

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646

$20.690

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Perfect Parts

USA . 10,879 parts In-Stock

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10,879

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Problanco Electronics

Mexico . 8,242 parts In-Stock

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Kulean Microsystems

USA . 7,136 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,809 parts In-Stock

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TANS Electronics

Latvia . 4,050 parts In-Stock

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4,050

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Continental Prestige Electronics

USA . 2,519 parts In-Stock

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$1.300

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2,519

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$1.300

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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SupplyDigital Components

Austria . 597 parts In-Stock

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597

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UHIMA Technologies

Türkiye . 382 parts In-Stock

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382

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Authorized Procurement Solutions

USA . 291 parts In-Stock

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291

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GreenTree Electronics

Israel . 291 parts In-Stock

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291

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Glotronic Ltd.

UK . 28 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Onsemi with the NTB6412ANT4G Power Field Effect Transistor. This N-Channel FET offers customers a high-performance solution with a built-in diode, operating in enhancement mode for maximum efficiency. Ideal for a wide range of applications, this transistor provides a seamless experience with its surface mount design and small outline package style. Trust Onsemi to deliver cutting-edge technology and superior value with the NTB6412ANT4G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protects the internal components of the FET, making it suitable for various applications and environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in electronic circuits due to their high efficiency and fast switching speeds, making this product a reliable choice for efficient power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reliable protection against reverse voltage and inductive kickback, enhancing the robustness and reliability of the FET in different operating conditions.

Maximum Drain Current (ID): 58 A

With a high maximum drain current rating, this FET can handle significant power loads and is suitable for applications requiring high current handling capabilities.

Maximum Power Dissipation (Abs): 167 W

The high power dissipation rating enables this FET to effectively manage heat dissipation, ensuring reliable performance even under high load conditions.

Maximum Operating Temperature: 175 °C

The FET is designed to operate at a high temperature range, making it suitable for applications where temperature fluctuations are common without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) NTB6412ANT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

58 A

Maximum Drain Current (ID):

58 A

Maximum Drain-Source On Resistance:

.0182 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTB6412ANT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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