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NTB6413ANT4G

Onsemi

NTB6413ANT4G by Onsemi

NTB6413ANT4G by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 178A IDM. Ideal for applications requiring high power dissipation, such as motor control systems or power supplies. Features include a built-in diode, small outline package style, and an operating temperature of up to 175 °C.

Median Price

$1.677

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 400 parts In-Stock

1+ parts

$0.937

100+ parts

$0.855

1k+ parts

$0.807

10k+ parts

-

400

$0.937

$0.855

$0.807

-

Arrow

USA . 605 parts In-Stock

1+ parts

$2.144

100+ parts

$1.101

1k+ parts

$0.915

10k+ parts

-

605

$2.144

$1.101

$0.915

-

Mouser Electronics

USA . 2,020 parts In-Stock

1+ parts

$2.210

100+ parts

$1.200

1k+ parts

$1.020

10k+ parts

-

2,020

$2.210

$1.200

$1.020

-

DigiKey

USA . 908 parts In-Stock

1+ parts

$2.940

100+ parts

$1.315

1k+ parts

$1.006

10k+ parts

$0.891

908

$2.940

$1.315

$1.006

$0.891

Verical

USA . 21,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.897

10k+ parts

-

21,600

-

-

$0.897

-

Flip Electronics (Authorized)

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,400

-

-

-

-

Rochester

USA . 775 parts In-Stock

1+ parts

-

100+ parts

$1.210

1k+ parts

$1.000

10k+ parts

$0.895

775

-

$1.210

$1.000

$0.895

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,059 parts In-Stock

1+ parts

$1.101

100+ parts

-

1k+ parts

-

10k+ parts

-

2,059

$1.101

-

-

-

Digiode

USA . 2,384 parts In-Stock

1+ parts

$2.037

100+ parts

-

1k+ parts

-

10k+ parts

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2,384

$2.037

-

-

-

Flip Electronics

USA . 47,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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47,200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 427 parts In-Stock

1+ parts

$1.101

100+ parts

-

1k+ parts

-

10k+ parts

-

427

$1.101

-

-

-

Corphita

USA . 2,033 parts In-Stock

1+ parts

$1.930

100+ parts

-

1k+ parts

-

10k+ parts

-

2,033

$1.930

-

-

-

Microchip USA

USA . 8,822 parts In-Stock

1+ parts

$8.124

100+ parts

-

1k+ parts

-

10k+ parts

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8,822

$8.124

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-

-

Perfect Parts

USA . 38,454 parts In-Stock

1+ parts

-

100+ parts

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38,454

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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-

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Problanco Electronics

Mexico . 8,350 parts In-Stock

1+ parts

-

100+ parts

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8,350

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-

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TANS Electronics

Latvia . 8,235 parts In-Stock

1+ parts

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8,235

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Kulean Microsystems

USA . 6,268 parts In-Stock

1+ parts

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6,268

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SupplyDigital Components

Austria . 494 parts In-Stock

1+ parts

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100+ parts

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494

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UHIMA Technologies

Türkiye . 396 parts In-Stock

1+ parts

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100+ parts

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396

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GreenTree Electronics

Israel . 230 parts In-Stock

1+ parts

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230

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Authorized Procurement Solutions

USA . 130 parts In-Stock

1+ parts

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130

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iodParts Technologies Inc.

India . 130 parts In-Stock

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130

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Overview

Unleash the power of innovation with the NTB6413ANT4G by Onsemi. Crafted with precision and expertise, this Power FET offers unrivaled quality and reliability. Ideal for a wide range of applications, this N-CHANNEL transistor delivers exceptional performance and efficiency. With a built-in diode and high operating temperature, this product ensures seamless functionality in any environment. Experience the value and benefits that Onsemi brings to the table with the NTB6413ANT4G, where cutting-edge technology meets unparalleled performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the transistor lightweight and durable, ensuring longevity and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making them suitable for various power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier design implementation and protection against reverse voltage spikes, enhancing the overall performance of the transistor.

Surface Mount: YES

Surface mount capability enables easy and compact PCB integration, making it ideal for space-constrained applications.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage ensures reliable operation under high voltage conditions, making it suitable for power applications.

Package Shape: RECTANGULAR

Rectangular package shape offers easy handling and efficient PCB layout, enhancing the overall design flexibility.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides precise control over the transistor's on/off state, leading to improved efficiency and performance.

Maximum Pulsed Drain Current (IDM): 178 A

High pulsed drain current rating allows for handling momentary surges in current, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 200 mJ

High avalanche energy rating ensures protection against avalanche breakdown, safeguarding the transistor from voltage spikes.

Maximum Drain Current (Abs) (ID): 42 A

The high drain current rating allows for handling substantial current flow, making it suitable for power electronics applications.

No. of Terminals: 2

Two terminals simplify the connection process, reducing complexity and enhancing ease of use.

Maximum Power Dissipation (Abs): 136 W

High power dissipation rating enables the transistor to handle significant power loads without overheating, ensuring reliable operation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high-speed operation and low input capacitance, enhancing the overall performance of the transistor.

Maximum Operating Temperature: 175 °C

High maximum operating temperature rating ensures stable operation even under elevated temperature conditions, making it suitable for various environments.

Transistor Element Material: SILICON

Silicon-based transistor element material offers high efficiency and reliability, ensuring consistent performance over time.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections.

Maximum Drain-Source On Resistance: 0.028 ohm

Low on-resistance leads to less power dissipation and higher efficiency, making it suitable for high current applications.

Terminal Position: SINGLE

Single terminal position simplifies the installation process and enhances ease of use.

Case Connection: DRAIN

Drain case connection offers easy heat dissipation, ensuring the transistor operates at optimal temperature levels.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient soldering, reducing production time and costs.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering and ensures proper connection integrity during manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) NTB6413ANT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

42 A

Maximum Drain Current (ID):

42 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

178 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTB6413ANT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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