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NTB6410ANG

Onsemi

NTB6410ANG by Onsemi

The Onsemi NTB6410ANG is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, 305A IDM, and 0.013 ohm RDS(on). Ideal for high-power applications requiring up to 188W dissipation. Suitable for surface mount designs in power electronics due to its small outline package and built-in diode.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 3,505 parts In-Stock

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Chip Stock

USA . 3,100 parts In-Stock

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Digiode

USA . 2,438 parts In-Stock

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2,438

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AZTECH Wire

Italy . 679 parts In-Stock

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$21.490

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679

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Kepictronics

USA . 13,000 parts In-Stock

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Problanco Electronics

Mexico . 7,168 parts In-Stock

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SupplyDigital Components

Austria . 6,930 parts In-Stock

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TANS Electronics

Latvia . 6,873 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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Kulean Microsystems

USA . 4,214 parts In-Stock

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Corphita

USA . 609 parts In-Stock

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UHIMA Technologies

Türkiye . 450 parts In-Stock

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Perfect Parts

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Corohmni

South Africa . 60 parts In-Stock

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Overview

Discover the power and reliability of the NTB6410ANG by Onsemi, a top-tier manufacturer in the industry. As a leading Power Field Effect Transistor (FET), this N-CHANNEL transistor offers unmatched performance and efficiency for a variety of applications. From its durable plastic/epoxy construction to its built-in diode configuration, this transistor is designed to exceed expectations. With a high operating temperature and maximum drain current, the NTB6410ANG delivers superior value and benefits to customers looking for a dependable solution. Experience the quality and innovation that Onsemi brings to the table with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and lightweight construction, ideal for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

Offers efficient switching performance and low on-resistance, making it suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and enhances performance by integrating a diode within the transistor.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 100 V

Ensures reliable operation at high voltage levels, suitable for power applications.

Maximum Pulsed Drain Current (IDM): 305 A

Capable of handling high current surges, making it suitable for demanding power circuits.

Maximum Power Dissipation (Abs): 188 W

Can dissipate heat effectively, allowing for continuous high power operation.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without performance degradation, ideal for harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) NTB6410ANG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

76 A

Maximum Drain Current (ID):

76 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

305 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTB6410ANG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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