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NTB6411ANG

Onsemi

NTB6411ANG by Onsemi

NTB6411ANG by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, 285A IDM, and 0.014 ohm RDS(on). It is used in applications requiring high power dissipation up to 217W, such as power supplies and motor control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 3,397 parts In-Stock

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ComSIT Distribution GmbH

Germany . 250 parts In-Stock

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250

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Digiode

USA . 58 parts In-Stock

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PC Components Company LLC

USA . 12 parts In-Stock

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Bristol Electronics

USA . 12 parts In-Stock

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Corohmni

South Africa . 114 parts In-Stock

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$1.930

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$1.930

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Microchip USA

USA . 397 parts In-Stock

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$10.400

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AZTECH Wire

Italy . 248 parts In-Stock

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$18.680

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Component Stockers USA

USA . 777 parts In-Stock

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$99.990

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Kepictronics

USA . 13,000 parts In-Stock

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SupplyDigital Components

Austria . 7,552 parts In-Stock

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Problanco Electronics

Mexico . 6,865 parts In-Stock

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TANS Electronics

Latvia . 3,142 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,782 parts In-Stock

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$1.530

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Corphita

USA . 1,677 parts In-Stock

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Kulean Microsystems

USA . 1,469 parts In-Stock

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UHIMA Technologies

Türkiye . 537 parts In-Stock

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Perfect Parts

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345

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Overview

Discover the superior quality and reliability of the NTB6411ANG by Onsemi, a leading manufacturer in the industry. As a Power Field Effect Transistor, this product offers unparalleled performance in various applications. With its N-CHANNEL configuration and built-in diode, this FET provides exceptional value and benefits to customers. Whether used in automotive, industrial, or consumer electronics, the NTB6411ANG delivers efficient power management and enhanced operational capabilities. Upgrade your systems with this high-performance transistor and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FET, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics than P-channel FETs, making this product a good choice for high efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and reduces the need for additional components.

Surface Mount: YES

Enables easy and efficient mounting onto circuit boards.

Maximum Pulsed Drain Current (IDM): 285 A

High current handling capability allows for reliable performance in demanding applications.

Maximum Power Dissipation (Abs): 217 W

High power dissipation rating ensures the FET can operate effectively without overheating.

Maximum Operating Temperature: 175 °C

Withstands high temperatures, making it suitable for applications where heat dissipation is a concern.

Technical Specifications

Power Field Effect Transistors (FET) NTB6411ANG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

470 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

77 A

Maximum Drain Current (ID):

72 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

285 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTB6411ANG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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