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NTB60N06T4G

Onsemi

NTB60N06T4G by Onsemi

NTB60N06T4G by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 180A IDM. Ideal for SWITCHING applications, it features a 0.014 ohm Drain-Source On Resistance and 454mJ Avalanche Energy Rating.

Median Price

$3.070

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 7,200 parts In-Stock

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$3.070

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Flip Electronics (Authorized)

USA . 7,200 parts In-Stock

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7,200

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Vyrian

USA . 334 parts In-Stock

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334

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Flip Electronics

USA . 7,200 parts In-Stock

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K-1 Technologies

USA . 6,148 parts In-Stock

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Chip Stock

USA . 3,000 parts In-Stock

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Digiode

USA . 2,115 parts In-Stock

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Cyclops Electronics Ltd

UK . 568 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 278 parts In-Stock

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$3.070

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278

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Component Stockers USA

USA . 3,398 parts In-Stock

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$7.360

100+ parts

$6.990

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$6.770

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3,398

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$6.770

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Kepictronics

USA . 13,000 parts In-Stock

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Perfect Parts

USA . 8,982 parts In-Stock

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TANS Electronics

Latvia . 7,865 parts In-Stock

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Problanco Electronics

Mexico . 4,361 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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SupplyDigital Components

Austria . 2,835 parts In-Stock

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Corphita

USA . 1,992 parts In-Stock

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Kulean Microsystems

USA . 758 parts In-Stock

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UHIMA Technologies

Türkiye . 485 parts In-Stock

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iodParts Technologies Inc.

India . 168 parts In-Stock

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Overview

Upgrade your power solutions with the NTB60N06T4G by Onsemi, a high-quality Power FET designed to enhance your switching applications. Manufactured by Onsemi, known for their reliable and innovative products, this N-channel transistor offers superior performance and efficiency. With a maximum drain current of 60A and a low on-resistance of 0.014 ohm, this transistor provides exceptional power dissipation and reliability. Whether you're in the automotive, industrial, or consumer electronics industry, the NTB60N06T4G is the perfect choice for your power needs. Experience the difference with Onsemi's cutting-edge technology and unlock new possibilities for your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally offer better performance and efficiency compared to P-Channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against back EMF, enhancing the functionality of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient performance in such scenarios.

Surface Mount: YES

Easily mountable on PCBs, making it suitable for compact and densely populated circuit designs.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages without risking damage, increasing its versatility in different circuits.

Maximum Pulsed Drain Current (IDM): 180 A

Capable of handling high current pulses, making it suitable for applications that require high power handling capabilities.

Maximum Power Dissipation (Abs): 150 W

With a high power dissipation rating, this FET can handle significant power loads without overheating, ensuring reliable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and efficiency, making this FET a reliable choice for various applications.

Maximum Operating Temperature: 175 °C

Capable of operating at high temperatures without performance degradation, suitable for environments with elevated heat levels.

Technical Specifications

Power Field Effect Transistors (FET) NTB60N06T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

454 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

180 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB60N06T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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