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NSBC144EPDXV6T5G

Onsemi

NSBC144EPDXV6T5G by Onsemi

NSBC144EPDXV6T5G by Onsemi is a Small Signal BJT with NPN and PNP channels, ideal for switching applications. It features 2 elements with built-in resistors, a max power dissipation of 0.5W, and can operate at temperatures up to 150 °C. This transistor has a collector-emitter voltage of 50V and a collector current of 0.1A, making it suitable for various electronic circuits requiring low-power amplification or switching functions in compact designs.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

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Digiode

USA . 736 parts In-Stock

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AZTECH Wire

Italy . 747 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

USA . 5,711 parts In-Stock

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SupplyDigital Components

Austria . 2,684 parts In-Stock

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Corphita

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Problanco Electronics

Mexico . 577 parts In-Stock

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TANS Electronics

Latvia . 394 parts In-Stock

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Corohmni

South Africa . 296 parts In-Stock

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Overview

Elevate your electronic designs with the NSBC144EPDXV6T5G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Small Signal Bipolar Junction Transistors. Perfect for switching applications, these NPN and PNP transistors come in a compact rectangular package with built-in resistors, making installation a breeze. With a maximum power dissipation of 0.5W and a minimum DC current gain of 80, this transistor offers exceptional performance while operating at temperatures up to 150 °C. Trust Onsemi to provide high-quality components that will enhance the functionality of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN AND PNP

Offers flexibility in circuit design as it can be used for both NPN and PNP configurations.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

Designed for switching applications and includes built-in resistors for convenience in circuit design.

Transistor Application: SWITCHING

Specifically optimized for switching operations, ensuring reliable performance in such applications.

Surface Mount: YES

Enables easy and secure mounting on PCBs, enhancing the overall efficiency of the assembly process.

Package Shape: RECTANGULAR

Compact rectangular shape allows for efficient use of space on the PCB.

Maximum Power Dissipation (Abs): 0.5 W

Can handle up to 0.5 W of power dissipation, making it suitable for low-power applications.

Minimum DC Current Gain (hFE): 80

High minimum DC current gain ensures consistent and stable performance in different operating conditions.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, increasing the range of applications it can be used in.

Maximum Collector-Emitter Voltage: 50 V

With a maximum voltage rating of 50 V, it can handle moderate voltage levels in circuits.

Maximum Collector Current (IC): 0.1 A

Capable of handling collector currents up to 0.1 A, suitable for low to moderate current applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and solderability for reliable connections.

Peak Reflow Temperature °C: 260

Can withstand peak reflow temperatures of 260 °C, ensuring proper soldering during assembly.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) NSBC144EPDXV6T5G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

80

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NSBC144EPDXV6T5G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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