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NSBC114EDXV6T5G

Onsemi

NSBC114EDXV6T5G by Onsemi

NSBC114EDXV6T5G by Onsemi is a NPN BJT transistor with 2 elements and built-in resistor, ideal for switching applications. It has a max collector-emitter voltage of 50V, max collector current of 0.1A, and min DC current gain of 35. This small outline package with matte tin finish operates up to 150 °C, making it suitable for various electronic devices.

Median Price

$0.062

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 7,988 parts In-Stock

1+ parts

$0.952

100+ parts

$0.194

1k+ parts

$0.113

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7,988

$0.952

$0.194

$0.113

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Flip Electronics (Authorized)

USA . 1,704,000 parts In-Stock

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Rochester

USA . 10,121 parts In-Stock

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$0.062

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$0.051

10k+ parts

$0.046

10,121

-

$0.062

$0.051

$0.046

Verical

USA . 8,000 parts In-Stock

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$0.058

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$0.058

Distributors (In-Stock)

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Digiode

USA . 2,059 parts In-Stock

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$0.050

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2,059

$0.050

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Flip Electronics

USA . 1,704,000 parts In-Stock

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1,704,000

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Chip Stock

USA . 25,000 parts In-Stock

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Vyrian

USA . 12,902 parts In-Stock

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12,902

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Distributors (Availability)

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Corphita

USA . 122 parts In-Stock

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$0.048

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122

$0.048

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Corohmni

South Africa . 384 parts In-Stock

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$0.053

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384

$0.053

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AZTECH Wire

Italy . 813 parts In-Stock

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$17.210

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813

$17.210

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Perfect Parts

USA . 59,947 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,264 parts In-Stock

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Kepictronics

USA . 14,000 parts In-Stock

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Authorized Procurement Solutions

USA . 7,988 parts In-Stock

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GreenTree Electronics

Israel . 7,988 parts In-Stock

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SupplyDigital Components

Austria . 7,607 parts In-Stock

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Problanco Electronics

Mexico . 6,055 parts In-Stock

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Microchip USA

USA . 5,415 parts In-Stock

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RC Electronics

USA . 4,590 parts In-Stock

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$0.100

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$0.090

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$0.090

4,590

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$0.090

$0.090

Kulean Microsystems

USA . 2,922 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,611 parts In-Stock

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UHIMA Technologies

Türkiye . 915 parts In-Stock

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TANS Electronics

Latvia . 767 parts In-Stock

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Overview

Elevate your electronic projects with the NSBC114EDXV6T5G by Onsemi, a high-quality Small Signal Bipolar Junction Transistor perfect for switching applications. Manufactured by Onsemi, a trusted name in the industry, this NPN transistor boasts a compact package body material and separate configuration with built-in resistors for seamless integration. With a maximum collector-emitter voltage of 50V and a minimum DC current gain of 35, this transistor offers reliable performance and efficiency. Upgrade your designs today with the NSBC114EDXV6T5G and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the transistor.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and saves space on the PCB.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance.

Surface Mount: YES

Can be easily mounted on the surface of the PCB, saving assembly time and space.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on the PCB and space-saving design.

Terminal Form: FLAT

Flat terminals provide secure connectivity and ease of soldering.

Maximum Power Dissipation: 0.5 W

Can handle up to 0.5 watts of power, suitable for a wide range of applications.

Minimum DC Current Gain (hFE): 35

Minimum DC current gain of 35 ensures stable and reliable amplification.

Maximum Operating Temperature: 150 °C

Can operate at temperatures up to 150 °C, suitable for harsh environments.

Maximum Collector-Emitter Voltage: 50 V

Can withstand up to 50 volts of collector-emitter voltage, suitable for medium voltage circuits.

Maximum Collector Current (IC): 0.1 A

Can handle up to 0.1 ampere of collector current, suitable for low to medium current applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability for the terminals.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C ensures proper soldering and reliability.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) NSBC114EDXV6T5G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

35

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NSBC114EDXV6T5G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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