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NSBC113EPDXV6T1G

Onsemi

NSBC113EPDXV6T1G by Onsemi

NSBC113EPDXV6T1G by Onsemi is a Small Signal BJT with NPN and PNP polarity, 2 elements with built-in resistor. It has a max collector-emitter voltage of 50V, 0.1A max collector current, and 0.5W power dissipation. Ideal for switching applications in surface mount designs due to its compact rectangular package shape.

Median Price

$0.067

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 7,779 parts In-Stock

1+ parts

$0.440

100+ parts

$0.334

1k+ parts

$0.184

10k+ parts

$0.080

7,779

$0.440

$0.334

$0.184

$0.080

Rochester

USA . 192,000 parts In-Stock

1+ parts

-

100+ parts

$0.066

1k+ parts

$0.054

10k+ parts

$0.049

192,000

-

$0.066

$0.054

$0.049

DigiKey

USA . 192,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.080

192,000

-

-

-

$0.080

Verical

USA . 192,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.061

192,000

-

-

-

$0.061

Newark

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.067

24,000

-

-

-

$0.067

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,783 parts In-Stock

1+ parts

$0.051

100+ parts

-

1k+ parts

-

10k+ parts

-

1,783

$0.051

-

-

-

Nova Conductors

Japan . 69 parts In-Stock

1+ parts

$0.114

100+ parts

-

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-

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-

69

$0.114

-

-

-

Vyrian

USA . 117,392 parts In-Stock

1+ parts

-

100+ parts

-

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117,392

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-

-

-

Flip Electronics

USA . 108,000 parts In-Stock

1+ parts

-

100+ parts

-

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108,000

-

-

-

-

Chip Stock

USA . 53,000 parts In-Stock

1+ parts

-

100+ parts

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53,000

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 117,236 parts In-Stock

1+ parts

$0.046

100+ parts

-

1k+ parts

-

10k+ parts

-

117,236

$0.046

-

-

-

Corphita

USA . 1,975 parts In-Stock

1+ parts

$0.049

100+ parts

-

1k+ parts

-

10k+ parts

-

1,975

$0.049

-

-

-

Corohmni

South Africa . 374 parts In-Stock

1+ parts

$0.054

100+ parts

-

1k+ parts

-

10k+ parts

-

374

$0.054

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.114

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

$0.114

-

-

-

Continental Prestige Electronics

USA . 192,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.061

10k+ parts

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192,000

-

-

$0.061

-

TANS Electronics

Latvia . 7,512 parts In-Stock

1+ parts

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7,512

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Kulean Microsystems

USA . 5,902 parts In-Stock

1+ parts

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5,902

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Problanco Electronics

Mexico . 4,954 parts In-Stock

1+ parts

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4,954

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UHIMA Technologies

Türkiye . 223 parts In-Stock

1+ parts

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223

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SupplyDigital Components

Austria . 152 parts In-Stock

1+ parts

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152

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Overview

Enhance your electronic projects with the NSBC113EPDXV6T1G by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This Small Signal Bipolar Junction Transistor (BJT) offers versatility for switching applications with its NPN and PNP configurations. With a compact rectangular package design and built-in resistor elements, this transistor is perfect for surface-mount applications. Enjoy the benefits of improved performance and efficiency with the NSBC113EPDXV6T1G, making it an essential component for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the transistor suitable for various applications.

Polarity or Channel Type: NPN AND PNP

Offers flexibility for different circuit configurations and requirements, allowing for versatile use.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and saves space on the PCB, making it easier to integrate into projects.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing reliable and efficient performance in ON/OFF states.

Surface Mount: YES

Enables easy and secure mounting onto the surface of a PCB, saving space and offering convenience during assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on the PCB, optimizing space utilization in electronic designs.

Terminal Form: FLAT

The flat terminals ensure secure connections and ease of soldering, contributing to a reliable electrical connection.

No. of Elements: 2

Having 2 elements allows for more complex circuit configurations and applications, enhancing the transistor's versatility.

Maximum Power Dissipation (Abs): 0.5 W

With a high maximum power dissipation, the transistor can handle demanding applications without overheating or malfunctioning.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices or tight layouts.

Minimum DC Current Gain (hFE): 3

The minimum DC current gain ensures reliable amplification and signal processing within the transistor's operating range.

Maximum Collector-Emitter Voltage: 50 V

The high maximum collector-emitter voltage allows for operation in a wide range of voltage levels, increasing the transistor's compatibility.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material for transistors, offering stable performance and durability.

Maximum Collector Current (IC): 0.1 A

The high maximum collector current rating indicates the transistor's capability to handle larger currents, ensuring efficient operation in various applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring a secure and long-lasting connection.

Terminal Position: DUAL

The dual terminal position allows for more versatile circuit designs and better connectivity options in electronic projects.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures the transistor's reliability during soldering processes and prevents heat-related damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the transistor can withstand the heat of the soldering process without damage.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) NSBC113EPDXV6T1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

3

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NSBC113EPDXV6T1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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