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NSBC113EF3T5G

Onsemi

NSBC113EF3T5G by Onsemi

NSBC113EF3T5G by Onsemi is a NPN BJT with built-in resistor for switching applications. It has a max collector-emitter voltage of 50V, collector current of 0.1A, and power dissipation of 0.297W. This small outline transistor in plastic package is AEC-Q101 compliant for automotive use.

Median Price

$0.048

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 320,000 parts In-Stock

1+ parts

-

100+ parts

$0.048

1k+ parts

$0.040

10k+ parts

$0.035

320,000

-

$0.048

$0.040

$0.035

DigiKey

USA . 320,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.060

320,000

-

-

-

$0.060

Verical

USA . 320,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.044

320,000

-

-

-

$0.044

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.035

100+ parts

-

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10

$0.035

-

-

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Digiode

USA . 1,899 parts In-Stock

1+ parts

$0.037

100+ parts

-

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1,899

$0.037

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-

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Vyrian

USA . 319,822 parts In-Stock

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319,822

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Chip Stock

USA . 79,000 parts In-Stock

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79,000

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Distributors (Availability)

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Ampacity Inc.

Singapore . 319,724 parts In-Stock

1+ parts

$0.033

100+ parts

-

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319,724

$0.033

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Corohmni

South Africa . 258 parts In-Stock

1+ parts

$0.034

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-

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258

$0.034

-

-

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.034

100+ parts

-

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$0.033

10k+ parts

-

50

$0.034

-

$0.033

-

Corphita

USA . 2,223 parts In-Stock

1+ parts

$0.035

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2,223

$0.035

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Component Stockers USA

USA . 367,547 parts In-Stock

1+ parts

$0.040

100+ parts

$0.040

1k+ parts

$0.030

10k+ parts

$0.030

367,547

$0.040

$0.040

$0.030

$0.030

Continental Prestige Electronics

USA . 320,000 parts In-Stock

1+ parts

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$0.047

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320,000

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$0.047

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Kulean Microsystems

USA . 8,013 parts In-Stock

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8,013

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SupplyDigital Components

Austria . 5,661 parts In-Stock

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5,661

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TANS Electronics

Latvia . 2,413 parts In-Stock

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2,413

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Microchip USA

USA . 2,313 parts In-Stock

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2,313

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UHIMA Technologies

Türkiye . 350 parts In-Stock

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350

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Problanco Electronics

Mexico . 287 parts In-Stock

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287

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Overview

Upgrade your electronic devices with the high-quality NSBC113EF3T5G Small Signal Bipolar Junction Transistor by Onsemi. Designed for switching applications, this NPN transistor offers exceptional performance and reliability. With a single configuration and built-in resistor, it simplifies circuit design while maximizing efficiency. Whether you're working on automotive, industrial, or consumer electronics, this surface-mount transistor is the perfect choice. Trust Onsemi's reputation for excellence and choose the NSBC113EF3T5G for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring reliable performance in various operating conditions.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification and switching purposes, making this product versatile in different applications.

Configuration: SINGLE WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and saves space, making it convenient for use in compact electronic devices.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable operation in circuits that require rapid switching speeds.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto printed circuit boards, simplifying the assembly process.

Maximum Power Dissipation (Abs): 0.297 W

With a high maximum power dissipation, this transistor can handle moderate power levels without getting damaged, ensuring long-term reliability.

Package Shape: RECTANGULAR

Rectangular package shape provides a standard form factor for easy integration into various electronic circuits and devices.

Terminal Form: FLAT

Flat terminal form allows for secure connections, preventing any accidental disconnections that could affect the performance of the transistor.

No. of Terminals: 3

Having 3 terminals allows for flexible circuit configurations and connections, providing versatility in different circuit designs.

Maximum Collector-Emitter Voltage: 50 V

The high maximum collector-emitter voltage rating ensures that the transistor can withstand high voltage fluctuations without breakdown, enhancing its reliability.

Transistor Element Material: SILICON

Silicon-based transistors offer superior performance characteristics, such as high switching speeds and low leakage currents, making them ideal for various applications.

Maximum Collector Current (IC): 0.1 A

The high maximum collector current rating allows the transistor to handle significant current loads, making it suitable for a wide range of applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides a reliable and durable connection for the terminals, ensuring long-term performance and stability in different operating conditions.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit connections, allowing for easy integration into various circuit layouts and designs.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 automotive industry standard ensures high-quality and reliability, making this product suitable for automotive applications where performance and durability are critical.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) NSBC113EF3T5G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTANCE RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

3

JESD-30 Code:

R-PDSO-F3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NSBC113EF3T5G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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