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NGTB75N60SWG

Onsemi

NGTB75N60SWG by Onsemi

NGTB75N60SWG by Onsemi is an N-CHANNEL IGBT with VCEsat of 2V, IC of 100A, and Pdiss of 595W. Ideal for power control applications due to its single configuration with built-in diode. Operates b/w -55 °C to 175°C temperature range in a rectangular package style.

Median Price

$3.645

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 894 parts In-Stock

1+ parts

-

100+ parts

$3.240

1k+ parts

$2.900

10k+ parts

$2.730

894

-

$3.240

$2.900

$2.730

Verical

USA . 894 parts In-Stock

1+ parts

-

100+ parts

$4.050

1k+ parts

$3.625

10k+ parts

$3.413

894

-

$4.050

$3.625

$3.413

Distributors (In-Stock)

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Digiode

USA . 342 parts In-Stock

1+ parts

$3.430

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342

$3.430

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Vyrian

USA . 5,034 parts In-Stock

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5,034

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Distributors (Availability)

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Corphita

USA . 1,359 parts In-Stock

1+ parts

$3.249

100+ parts

-

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1,359

$3.249

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Corohmni

South Africa . 118 parts In-Stock

1+ parts

$3.380

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-

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118

$3.380

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AZTECH Wire

Italy . 153 parts In-Stock

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$18.010

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153

$18.010

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Microchip USA

USA . 128 parts In-Stock

1+ parts

$22.490

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128

$22.490

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Problanco Electronics

Mexico . 5,596 parts In-Stock

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5,596

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SupplyDigital Components

Austria . 5,332 parts In-Stock

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TANS Electronics

Latvia . 1,858 parts In-Stock

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1,858

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UHIMA Technologies

Türkiye . 936 parts In-Stock

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936

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Continental Prestige Electronics

USA . 914 parts In-Stock

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$3.380

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914

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$3.380

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Kulean Microsystems

USA . 316 parts In-Stock

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316

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Perfect Parts

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Overview

Power up your applications with the NGTB75N60SWG by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-notch quality with this Insulated Gate Bipolar Transistor. Perfect for power control, this N-channel transistor offers a maximum VCEsat of 2V and a maximum collector current of 100A, ensuring optimal performance. With a built-in diode and a maximum operating temperature of 175 °C, this transistor is versatile and reliable for a wide range of applications. Don't settle for anything less than the best - choose Onsemi for superior quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and protection for the internal components of the IGBT, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency compared to P-channel IGBTs, making them a good choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and can provide protection against reverse voltage spikes, making this IGBT a versatile option for power control applications.

Maximum VCEsat: 2 V

The low VCEsat voltage of 2 V results in lower conduction losses and higher efficiency, making this IGBT suitable for high-power applications.

Maximum Power Dissipation (Abs): 595 W

With a high power dissipation of 595 W, this IGBT can handle high power levels without overheating, ensuring reliable operation in demanding conditions.

Maximum Collector-Emitter Voltage: 600 V

The high collector-emitter voltage rating of 600 V allows this IGBT to be used in high voltage applications, providing versatility and flexibility in power control circuits.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The low gate-emitter threshold voltage of 6.5 V ensures fast and efficient switching of the IGBT, making it suitable for high frequency applications.

Nominal Turn On Time (ton): 150 ns

The fast turn-on time of 150 ns enables quick response and precise control of the IGBT, making it ideal for power control applications where timing is critical.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB75N60SWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

380 ns

Nominal Turn On Time (ton):

150 ns

Maximum VCEsat:

2 V

Trade Compliance

NGTB75N60SWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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