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NGTB20N120IHLWG

Onsemi

NGTB20N120IHLWG by Onsemi

NGTB20N120IHLWG by Onsemi is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 40A max collector current, and 485ns nominal turn off time. Ideal for power control applications, it features a single configuration with built-in diode in a rectangular package style suitable for flange mount installations.

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 2,232 parts In-Stock

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Digiode

USA . 1,914 parts In-Stock

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$1.464

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$1.332

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$1.200

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Microchip USA

USA . 190 parts In-Stock

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$7.280

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AZTECH Wire

Italy . 460 parts In-Stock

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$15.570

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A-Z Elektronik GmbH

Germany . 7,337 parts In-Stock

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TANS Electronics

Latvia . 7,028 parts In-Stock

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Kulean Microsystems

USA . 5,517 parts In-Stock

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Problanco Electronics

Mexico . 4,776 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 1,239 parts In-Stock

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SupplyDigital Components

Austria . 731 parts In-Stock

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Perfect Parts

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Corohmni

South Africa . 481 parts In-Stock

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UHIMA Technologies

Türkiye . 27 parts In-Stock

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Overview

Enhance your power control applications with the NGTB20N120IHLWG by Onsemi. This N-CHANNEL Insulated Gate Bipolar Transistor (IGBT) offers top-quality performance with a single configuration and built-in diode for added convenience. With a maximum collector-emitter voltage of 1200V and a maximum gate-emitter voltage of 20V, this transistor is designed to handle high-power dissipation up to 192W. Trust in Onsemi's reputation for excellence in semiconductor manufacturing and take advantage of the value and benefits this IGBT provides for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight yet durable packaging for the IGBT, making it ideal for power control applications where weight and size are important considerations.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs offer lower conduction losses and faster switching speeds compared to P-Channel types, making them more efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for faster and more efficient commutation during switching operations, reducing losses and improving overall performance.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and reliability in controlling high power levels.

Package Shape: RECTANGULAR

The rectangular shape provides a convenient form factor for mounting and integration into power control systems.

Nominal Turn Off Time (toff): 485 ns

The fast turn-off time allows for precise control and efficient switching operations, essential for high-performance power control applications.

Maximum Power Dissipation (Abs): 192 W

With a high maximum power dissipation, this IGBT can handle heavy power loads without overheating or performance degradation.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature makes this IGBT suitable for applications where heat dissipation is a concern, allowing for reliable operation in challenging environments.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage rating, this IGBT can withstand high voltage levels commonly encountered in power control applications.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage rating ensures safe and reliable operation under various conditions, protecting the IGBT from voltage spikes and transients.

Maximum Collector Current (IC): 40 A

Capable of handling high collector currents, making it suitable for power control applications that require handling large power levels.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage defines the turn-on behavior of the IGBT, ensuring reliable and consistent switching performance in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB20N120IHLWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

485 ns

Trade Compliance

NGTB20N120IHLWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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