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NGB8207ABNT4G

Onsemi

NGB8207ABNT4G by Onsemi

NGB8207ABNT4G by Onsemi is an N-CHANNEL IGBT with 2700ns rise time, 15000ns fall time, and 165W power dissipation. Ideal for applications requiring a max collector-emitter voltage of 365V, such as power supplies or motor control systems.

Median Price

$0.822

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30,096 parts In-Stock

1+ parts

-

100+ parts

$0.793

1k+ parts

$0.658

10k+ parts

$0.587

30,096

-

$0.793

$0.658

$0.587

DigiKey

USA . 30,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.990

10k+ parts

-

30,096

-

-

$0.990

-

Verical

USA . 28,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.822

10k+ parts

$0.733

28,800

-

-

$0.822

$0.733

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 125 parts In-Stock

1+ parts

$0.618

100+ parts

-

1k+ parts

-

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125

$0.618

-

-

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Vyrian

USA . 651 parts In-Stock

1+ parts

$0.650

100+ parts

-

1k+ parts

-

10k+ parts

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651

$0.650

-

-

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DigiKey Marketplace

USA . 30,096 parts In-Stock

1+ parts

-

100+ parts

$0.680

1k+ parts

-

10k+ parts

-

30,096

-

$0.680

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

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50

-

-

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Distributors (Availability)

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Ampacity Inc.

Singapore . 29,762 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

-

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-

29,762

$0.550

-

-

-

Corphita

USA . 2,456 parts In-Stock

1+ parts

$0.585

100+ parts

-

1k+ parts

-

10k+ parts

-

2,456

$0.585

-

-

-

Corohmni

South Africa . 142 parts In-Stock

1+ parts

$0.650

100+ parts

-

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142

$0.650

-

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Microchip USA

USA . 3,895 parts In-Stock

1+ parts

$7.662

100+ parts

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3,895

$7.662

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Perfect Parts

USA . 40,154 parts In-Stock

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40,154

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Continental Prestige Electronics

USA . 30,096 parts In-Stock

1+ parts

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100+ parts

$0.780

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30,096

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$0.780

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Kepictronics

USA . 12,800 parts In-Stock

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12,800

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TANS Electronics

Latvia . 7,337 parts In-Stock

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7,337

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A-Z Elektronik GmbH

Germany . 7,211 parts In-Stock

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7,211

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Problanco Electronics

Mexico . 6,833 parts In-Stock

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6,833

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Kulean Microsystems

USA . 6,557 parts In-Stock

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6,557

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Argo Parts USA

USA . 3,425 parts In-Stock

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3,425

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SupplyDigital Components

Austria . 2,851 parts In-Stock

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2,851

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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UHIMA Technologies

Türkiye . 915 parts In-Stock

1+ parts

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915

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Aranea Global

USA . 50 parts In-Stock

1+ parts

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50

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Overview

Unlock the power of cutting-edge technology with the NGB8207ABNT4G by Onsemi. As a leader in the industry, Onsemi delivers unparalleled quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). With its N-CHANNEL design and surface mount capability, this product offers maximum performance in a compact package. Whether you're in automotive, industrial, or renewable energy applications, this IGBT provides the efficiency and power you need to drive your projects forward. Trust Onsemi for superior products that deliver value and innovation to customers.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher current-carrying capability compared to P-channel IGBTs, making them ideal for high power applications.

Surface Mount: YES

Surface mount IGBTs are easy to install on printed circuit boards, making them suitable for automated manufacturing processes and compact designs.

Maximum Rise Time (tr): 2700 ns

The fast rise time of 2700 ns allows for quick switching speeds, suitable for applications requiring precise control and high frequency operation.

Maximum Fall Time (tf): 15000 ns

The relatively slow fall time of 15000 ns can reduce the chances of voltage spikes and EMI issues during switching transitions, enhancing the reliability of the system.

Maximum Power Dissipation (Abs): 165 W

With a high maximum power dissipation of 165 W, this IGBT can handle significant power levels, making it well-suited for demanding applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C allows this IGBT to operate reliably in harsh environmental conditions without thermal shutdown issues.

Maximum Collector-Emitter Voltage: 365 V

The high maximum collector-emitter voltage of 365 V provides a wide voltage handling capability, making this IGBT suitable for various voltage levels in different applications.

Maximum Gate-Emitter Voltage: 15 V

The 15 V maximum gate-emitter voltage ensures safe and reliable operation of the IGBT, protecting it from potential damage due to overvoltage conditions.

Maximum Collector Current (IC): 20 A

With a high maximum collector current of 20 A, this IGBT can handle substantial current levels, making it suitable for high power applications.

Maximum Gate-Emitter Threshold Voltage: 2 V

The low 2 V gate-emitter threshold voltage ensures efficient turn-on of the IGBT, reducing power losses and enhancing overall performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term performance of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGB8207ABNT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

365 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2 V

Maximum Gate-Emitter Voltage:

15 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

2700 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Trade Compliance

NGB8207ABNT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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