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NGB8206NT4G

Onsemi

NGB8206NT4G by Onsemi

NGB8206NT4G by Onsemi is an N-CHANNEL IGBT with built-in diode and resistor, ideal for automotive ignition applications. It has a max collector-emitter voltage of 390V, collector current of 20A, and power dissipation of 150W. This surface-mount transistor operates at up to 175 °C with rise time of 8000ns and fall time of 14000ns.

Median Price

$1.563

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 892 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.150

10k+ parts

$1.030

892

-

$1.390

$1.150

$1.030

DigiKey

USA . 892 parts In-Stock

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-

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$1.740

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892

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$1.740

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Verical

USA . 892 parts In-Stock

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-

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-

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$1.563

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-

892

-

-

$1.563

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Distributors (In-Stock)

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Vyrian

USA . 2,372 parts In-Stock

1+ parts

$0.943

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2,372

$0.943

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Digiode

USA . 1,328 parts In-Stock

1+ parts

$1.083

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1,328

$1.083

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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150

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Distributors (Availability)

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Corohmni

South Africa . 349 parts In-Stock

1+ parts

$0.943

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-

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349

$0.943

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Corphita

USA . 2,467 parts In-Stock

1+ parts

$1.026

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2,467

$1.026

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Component Stockers USA

USA . 670 parts In-Stock

1+ parts

$1.160

100+ parts

$1.090

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-

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670

$1.160

$1.090

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$1.613

100+ parts

$1.468

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$1.323

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-

50

$1.613

$1.468

$1.323

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Kulean Microsystems

USA . 5,938 parts In-Stock

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Problanco Electronics

Mexico . 5,327 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,250 parts In-Stock

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2,250

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Continental Prestige Electronics

USA . 892 parts In-Stock

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$0.915

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892

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$0.915

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UHIMA Technologies

Türkiye . 804 parts In-Stock

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SupplyDigital Components

Austria . 475 parts In-Stock

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475

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TANS Electronics

Latvia . 360 parts In-Stock

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360

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Overview

Discover the power and efficiency of the NGB8206NT4G by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. With applications in automotive ignition systems, this N-CHANNEL transistor offers unparalleled performance with its built-in diode and resistor configuration. Experience the value and benefits of this product, from its high power dissipation to its maximum operating temperature of 175 °C. Trust Onsemi to provide reliable solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring durability and reliability in automotive ignition applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have better performance characteristics and are commonly used in automotive ignition systems for efficient power handling.

Maximum Power Dissipation (Abs): 150 W

With a high maximum power dissipation, this IGBT can handle high power levels in automotive ignition systems without overheating or failing.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for reliable operation in automotive environments where temperatures can vary greatly.

Maximum Collector-Emitter Voltage: 390 V

This high voltage rating enables the IGBT to handle high voltage spikes and surges commonly found in automotive ignition systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGB8206NT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

VOLTAGE CLAMPING

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

390 V

Maximum Fall Time (tf):

14000 ns

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

15 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

8000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

18500 ns

Nominal Turn On Time (ton):

6500 ns

Trade Compliance

NGB8206NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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