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NGB8202ANT4G

Onsemi

NGB8202ANT4G by Onsemi

NGB8202ANT4G by Onsemi is an N-CHANNEL IGBT with built-in diode and resistor, ideal for power control applications. It has a max collector-emitter voltage of 440V, collector current of 20A, and power dissipation of 150W. With a rise time of 8000ns and fall time of 14000ns, it operates at temperatures up to 175°C.

Median Price

$0.705

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 37 parts In-Stock

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$0.705

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37

$0.705

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Digiode

USA . 1,789 parts In-Stock

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$0.661

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1,789

$0.661

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Vyrian

USA . 3,295 parts In-Stock

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ComSIT Distribution GmbH

Germany . 759 parts In-Stock

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Corphita

USA . 1,538 parts In-Stock

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$0.626

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$0.626

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Corohmni

South Africa . 198 parts In-Stock

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$0.687

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198

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Andel Nordic

Denmark . 4,867 parts In-Stock

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$7.880

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$5.513

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$5.513

4,867

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$5.513

$5.513

Kulean Microsystems

USA . 7,717 parts In-Stock

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Perfect Parts

USA . 7,252 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,265 parts In-Stock

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SupplyDigital Components

Austria . 4,792 parts In-Stock

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TANS Electronics

Latvia . 3,575 parts In-Stock

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Problanco Electronics

Mexico . 1,670 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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GreenTree Electronics

Israel . 975 parts In-Stock

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UHIMA Technologies

Türkiye . 568 parts In-Stock

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Overview

Unleash the power of innovation with the NGB8202ANT4G by Onsemi. This Insulated Gate Bipolar Transistor (IGBT) stands out for its superior quality and reliability, thanks to Onsemi's renowned manufacturing expertise. Ideal for power control applications, this N-CHANNEL transistor offers a single configuration with a built-in diode and resistor, providing customers with unmatched convenience and efficiency. With a maximum operating temperature of 175°C and a maximum collector-emitter voltage of 440V, the NGB8202ANT4G ensures optimal performance even in the most demanding environments. Elevate your projects with this cutting-edge solution from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides good insulation and durability, making this IGBT suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs offer lower conduction losses and higher efficiency compared to P-channel types, making this a good choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Having a built-in diode and resistor simplifies circuit design and saves space, making this IGBT convenient for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT ensures efficient and reliable performance.

Maximum Power Dissipation (Abs): 150 W

With a high power dissipation capability, this IGBT can handle large amounts of power without overheating.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGB8202ANT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

440 V

Maximum Fall Time (tf):

14000 ns

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

15 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

8000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

18500 ns

Nominal Turn On Time (ton):

6500 ns

Trade Compliance

NGB8202ANT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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