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NGB8206ANTF4G

Onsemi

NGB8206ANTF4G by Onsemi

NGB8206ANTF4G by Onsemi is an N-CHANNEL IGBT with tr of 8000 ns, tf of 14000 ns, and Pdiss of 150 W. Ideal for applications requiring high power dissipation and voltage handling capabilities in surface mount designs.

Median Price

$1.520

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 298 parts In-Stock

1+ parts

$1.128

100+ parts

$1.057

1k+ parts

$1.039

10k+ parts

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298

$1.128

$1.057

$1.039

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Rochester

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

$1.490

1k+ parts

$1.240

10k+ parts

$1.100

2,800

-

$1.490

$1.240

$1.100

DigiKey

USA . 2,800 parts In-Stock

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-

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$1.860

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2,800

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$1.860

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Verical

USA . 2,800 parts In-Stock

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-

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$1.550

10k+ parts

$1.375

2,800

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-

$1.550

$1.375

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 985 parts In-Stock

1+ parts

$0.984

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-

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985

$0.984

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Digiode

USA . 935 parts In-Stock

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$1.072

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935

$1.072

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DigiKey Marketplace

USA . 2,800 parts In-Stock

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100+ parts

$1.270

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2,800

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$1.270

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 384 parts In-Stock

1+ parts

$0.984

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384

$0.984

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Corphita

USA . 2,199 parts In-Stock

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$1.015

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2,199

$1.015

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Component Stockers USA

USA . 7,726 parts In-Stock

1+ parts

$1.110

100+ parts

$1.040

1k+ parts

$1.060

10k+ parts

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7,726

$1.110

$1.040

$1.060

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Microchip USA

USA . 5,617 parts In-Stock

1+ parts

$7.670

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5,617

$7.670

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TANS Electronics

Latvia . 6,700 parts In-Stock

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6,700

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SupplyDigital Components

Austria . 4,511 parts In-Stock

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Perfect Parts

USA . 3,373 parts In-Stock

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3,373

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Continental Prestige Electronics

USA . 2,800 parts In-Stock

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$0.984

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2,800

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$0.984

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Problanco Electronics

Mexico . 1,596 parts In-Stock

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1,596

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Kulean Microsystems

USA . 1,321 parts In-Stock

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1,321

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UHIMA Technologies

Türkiye . 83 parts In-Stock

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83

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Overview

Unleash the power of innovation with the NGB8206ANTF4G by Onsemi. With a focus on quality and reliability, Onsemi sets the standard in the world of Insulated Gate Bipolar Transistors (IGBT). This N-CHANNEL transistor offers exceptional performance and efficiency, making it perfect for a wide range of applications. From industrial machinery to automotive electronics, this versatile component delivers unparalleled value, benefits, and advantages to customers looking to take their projects to the next level. Trust Onsemi to provide the tools you need to succeed.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL type IGBTs offer lower conduction losses and higher efficiency compared to P-CHANNEL type, making them a good choice for applications requiring high power.

Surface Mount: YES

Surface mount packaging allows for easy and space-saving integration onto PCBs, simplifying the design and assembly process.

Maximum Rise Time (tr): 8000 ns

The fast rise time of 8000 ns ensures quick switching performance, making this IGBT ideal for applications that require rapid switching such as motor control.

Maximum Fall Time (tf): 14000 ns

The 14000 ns fall time ensures efficient turn-off of the IGBT, reducing switching losses and improving overall system efficiency.

Maximum Power Dissipation (Abs): 150 W

With a high maximum power dissipation of 150 W, this IGBT can handle high power levels without overheating, ensuring reliable operation in demanding applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C allows this IGBT to withstand elevated temperature conditions, increasing its reliability and longevity.

Maximum Collector-Emitter Voltage: 390 V

The high maximum collector-emitter voltage of 390 V enables the IGBT to be used in high voltage applications, providing a wide range of operational flexibility.

Maximum Gate-Emitter Voltage: 15 V

The 15 V maximum gate-emitter voltage ensures safe and reliable operation of the IGBT, protecting it from excessive gate voltage that could lead to damage.

Maximum Collector Current (IC): 20 A

A high maximum collector current of 20 A allows this IGBT to handle high current loads, making it suitable for power electronics applications requiring high current capability.

Maximum Gate-Emitter Threshold Voltage: 2.1 V

The 2.1 V gate-emitter threshold voltage ensures that the IGBT switches on and off properly, enhancing its overall performance and reliability in various applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection and long-term performance of the IGBT in different environmental conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGB8206ANTF4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

390 V

Maximum Fall Time (tf):

14000 ns

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

15 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

8000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Trade Compliance

NGB8206ANTF4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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