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NGB8206ANT4G

Onsemi

NGB8206ANT4G by Onsemi

NGB8206ANT4G by Onsemi is an N-CHANNEL IGBT with 20A IC, 390V VCE, and 150W Pd. It is used for POWER CONTROL applications, featuring a built-in diode and resistor in a small outline package suitable for surface mount assembly.

Median Price

$0.877

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30,020 parts In-Stock

1+ parts

-

100+ parts

$0.846

1k+ parts

$0.702

10k+ parts

$0.626

30,020

-

$0.846

$0.702

$0.626

DigiKey

USA . 30,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.060

10k+ parts

-

30,020

-

-

$1.060

-

Verical

USA . 30,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.877

10k+ parts

$0.782

30,020

-

-

$0.877

$0.782

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,295 parts In-Stock

1+ parts

$0.558

100+ parts

-

1k+ parts

-

10k+ parts

-

2,295

$0.558

-

-

-

Digiode

USA . 1,657 parts In-Stock

1+ parts

$0.658

100+ parts

-

1k+ parts

-

10k+ parts

-

1,657

$0.658

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 31,922 parts In-Stock

1+ parts

$0.474

100+ parts

-

1k+ parts

-

10k+ parts

-

31,922

$0.474

-

-

-

Corohmni

South Africa . 226 parts In-Stock

1+ parts

$0.558

100+ parts

-

1k+ parts

-

10k+ parts

-

226

$0.558

-

-

-

Corphita

USA . 1,999 parts In-Stock

1+ parts

$0.624

100+ parts

-

1k+ parts

-

10k+ parts

-

1,999

$0.624

-

-

-

Component Stockers USA

USA . 91,354 parts In-Stock

1+ parts

$0.710

100+ parts

$0.670

1k+ parts

$0.610

10k+ parts

$0.610

91,354

$0.710

$0.670

$0.610

$0.610

Microchip USA

USA . 3,152 parts In-Stock

1+ parts

$4.355

100+ parts

-

1k+ parts

-

10k+ parts

-

3,152

$4.355

-

-

-

Continental Prestige Electronics

USA . 34,020 parts In-Stock

1+ parts

-

100+ parts

$0.558

1k+ parts

-

10k+ parts

-

34,020

-

$0.558

-

-

TANS Electronics

Latvia . 6,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,257

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,994 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,994

-

-

-

-

Kulean Microsystems

USA . 4,532 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,532

-

-

-

-

Problanco Electronics

Mexico . 2,838 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,838

-

-

-

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SupplyDigital Components

Austria . 1,534 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,534

-

-

-

-

UHIMA Technologies

Türkiye . 101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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101

-

-

-

-

Overview

Unlock the power of efficiency and reliability with the NGB8206ANT4G by Onsemi. As a leader in manufacturing insulated gate bipolar transistors, Onsemi ensures top-quality products that deliver exceptional performance in power control applications. This single-channel transistor comes with a built-in diode and resistor, offering convenience and value to customers. With a maximum collector-emitter voltage of 390V and a maximum power dissipation of 150W, this transistor is designed to meet your high-power needs. Trust Onsemi for cutting-edge technology that brings innovation to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the IGBT, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency compared to P-channel types, making this product energy efficient.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor make the IGBT easier to use in power control applications and can simplify the overall circuit design.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for efficient and reliable power management.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly, reducing manufacturing time and costs.

Maximum Power Dissipation (Abs): 150 W

With a high maximum power dissipation, this IGBT can handle significant power loads, making it suitable for heavy-duty applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature means that this IGBT can withstand high temperatures without performance degradation, ensuring reliability in harsh environments.

Maximum Collector-Emitter Voltage: 390 V

The high maximum collector-emitter voltage rating allows this IGBT to be used in applications with higher voltage requirements.

Maximum Collector Current (IC): 20 A

The high maximum collector current rating makes this IGBT suitable for applications requiring high current handling.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGB8206ANT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

390 V

Maximum Fall Time (tf):

14000 ns

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

15 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

8000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

18500 ns

Nominal Turn On Time (ton):

6500 ns

Trade Compliance

NGB8206ANT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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