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NGB8202NT4G

Onsemi

NGB8202NT4G by Onsemi

NGB8202NT4G by Onsemi is an N-CHANNEL IGBT with a max Collector-Emitter Voltage of 440V and Max Collector Current of 20A. It features a built-in diode and resistor, making it ideal for POWER CONTROL applications. With a small outline package style and surface mount capability, it offers efficient performance up to 175°C operating temperature.

Median Price

$1.414

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,057 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.150

10k+ parts

$1.030

5,057

-

$1.390

$1.150

$1.030

Verical

USA . 2,957 parts In-Stock

1+ parts

-

100+ parts

-

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$1.438

10k+ parts

$1.288

2,957

-

-

$1.438

$1.288

Distributors (In-Stock)

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Digiode

USA . 1,722 parts In-Stock

1+ parts

$1.083

100+ parts

-

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1,722

$1.083

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Vyrian

USA . 4,656 parts In-Stock

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4,656

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North Shore Components

USA . 72 parts In-Stock

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72

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Distributors (Availability)

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Corphita

USA . 1,419 parts In-Stock

1+ parts

$1.026

100+ parts

-

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-

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1,419

$1.026

-

-

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Corohmni

South Africa . 415 parts In-Stock

1+ parts

$1.140

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415

$1.140

-

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Microchip USA

USA . 400 parts In-Stock

1+ parts

$7.085

100+ parts

-

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400

$7.085

-

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AZTECH Wire

Italy . 108 parts In-Stock

1+ parts

$9.030

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108

$9.030

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Continental Prestige Electronics

USA . 15,457 parts In-Stock

1+ parts

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100+ parts

$1.090

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15,457

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$1.090

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Kulean Microsystems

USA . 6,306 parts In-Stock

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6,306

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A-Z Elektronik GmbH

Germany . 6,182 parts In-Stock

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6,182

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Problanco Electronics

Mexico . 3,797 parts In-Stock

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TANS Electronics

Latvia . 3,280 parts In-Stock

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3,280

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UHIMA Technologies

Türkiye . 493 parts In-Stock

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493

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Perfect Parts

USA . 354 parts In-Stock

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354

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SupplyDigital Components

Austria . 226 parts In-Stock

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226

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Overview

Enhance the power control in your applications with the NGB8202NT4G by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor. With its superior quality and reliability, this single-channel device comes with a built-in diode and resistor, making it perfect for various power control needs. Say goodbye to overheating and inefficiency as this IGBT offers a maximum power dissipation of 150W and can handle up to 20A of collector current. Trust in Onsemi's expertise in semiconductor manufacturing and experience seamless power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making it suitable for various applications

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and operation in N-channel configurations

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Simplifies the design and circuitry by integrating diode and resistor within the transistor

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable performance

Surface Mount: YES

Enables easy installation on PCBs, saving space and facilitating automated assembly processes

Maximum Power Dissipation (Abs): 150 W

Capable of handling high power dissipation, making it suitable for demanding applications

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without compromising performance, ensuring reliability

Maximum Collector-Emitter Voltage: 440 V

Can handle high voltage levels, making it suitable for power control applications

Maximum Collector Current (IC): 20 A

Capable of handling high currents, ensuring efficient power control

Maximum Gate-Emitter Voltage: 15 V

Provides proper voltage margin for gate control, ensuring stable operation

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGB8202NT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

440 V

Maximum Fall Time (tf):

14000 ns

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

15 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

8000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

18500 ns

Nominal Turn On Time (ton):

6500 ns

Trade Compliance

NGB8202NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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