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NGB8206ANSL3G

Onsemi

NGB8206ANSL3G by Onsemi

NGB8206ANSL3G by Onsemi is an N-CHANNEL IGBT with 8000ns rise time, 14000ns fall time, and 150W power dissipation. Ideal for applications requiring a max collector-emitter voltage of 390V, such as power supplies and motor control systems.

Median Price

$0.877

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

$0.846

1k+ parts

$0.702

10k+ parts

$0.626

2,800

-

$0.846

$0.702

$0.626

DigiKey

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.060

10k+ parts

-

2,800

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-

$1.060

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Verical

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.877

10k+ parts

$0.782

2,800

-

-

$0.877

$0.782

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,733 parts In-Stock

1+ parts

$0.558

100+ parts

-

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1,733

$0.558

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Digiode

USA . 1,675 parts In-Stock

1+ parts

$0.658

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-

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1,675

$0.658

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DigiKey Marketplace

USA . 2,800 parts In-Stock

1+ parts

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100+ parts

$0.720

1k+ parts

-

10k+ parts

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2,800

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$0.720

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 228 parts In-Stock

1+ parts

$0.558

100+ parts

-

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228

$0.558

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Corphita

USA . 537 parts In-Stock

1+ parts

$0.624

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537

$0.624

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Microchip USA

USA . 4,468 parts In-Stock

1+ parts

$4.355

100+ parts

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4,468

$4.355

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Problanco Electronics

Mexico . 6,196 parts In-Stock

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6,196

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TANS Electronics

Latvia . 5,830 parts In-Stock

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5,830

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Continental Prestige Electronics

USA . 2,800 parts In-Stock

1+ parts

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100+ parts

$0.558

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2,800

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$0.558

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SupplyDigital Components

Austria . 2,344 parts In-Stock

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2,344

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Kulean Microsystems

USA . 2,009 parts In-Stock

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2,009

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UHIMA Technologies

Türkiye . 577 parts In-Stock

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577

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Perfect Parts

USA . 449 parts In-Stock

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449

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Overview

Elevate your power management solutions with the NGB8206ANSL3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are perfect for a wide range of applications. With its N-CHANNEL design and surface mount capability, this IGBT offers exceptional performance and reliability. Experience the benefits of maximum power dissipation, high operating temperature, and efficient power handling, making it an ideal choice for any project. Upgrade your electronics with the NGB8206ANSL3G and unlock a world of possibilities.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower conduction losses compared to P-CHANNEL types, making them more efficient in high power applications.

Surface Mount: YES

Surface mount IGBTs are easier to integrate onto circuit boards and are more space-efficient, making them ideal for compact electronic designs.

Maximum Rise Time (tr): 8000 ns

The fast rise time of 8000 ns ensures quick switching speeds, reducing switching losses and improving overall efficiency of the IGBT.

Maximum Fall Time (tf): 14000 ns

The longer fall time of 14000 ns allows for better control and elimination of voltage spikes during switching events, ensuring stable operation of the device.

Maximum Power Dissipation (Abs): 150 W

With a maximum power dissipation of 150 W, this IGBT can handle high power loads without overheating, ensuring reliable performance under demanding conditions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C allows this IGBT to withstand elevated temperatures, making it suitable for industrial and automotive applications.

Maximum Collector-Emitter Voltage: 390 V

The high maximum collector-emitter voltage rating of 390 V provides a wide margin of safety for the IGBT, allowing it to handle high voltage spikes and transients.

Maximum Gate-Emitter Voltage: 15 V

The maximum gate-emitter voltage of 15 V ensures safe and reliable operation of the IGBT, protecting it from overvoltage conditions that can damage the device.

Maximum Collector Current (IC): 20 A

With a maximum collector current of 20 A, this IGBT can handle high current loads, making it suitable for power electronics and motor control applications.

Maximum Gate-Emitter Threshold Voltage: 2.1 V

The low gate-emitter threshold voltage of 2.1 V ensures efficient and reliable switching of the IGBT, reducing power losses and improving overall performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections in electronic assemblies.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGB8206ANSL3G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

390 V

Maximum Fall Time (tf):

14000 ns

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

15 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

8000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Trade Compliance

NGB8206ANSL3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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