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MUN5237T1

Onsemi

MUN5237T1 by Onsemi

MUN5237T1 by Onsemi is a NPN BJT transistor with built-in resistor for switching applications. It has a max collector-emitter voltage of 50V, max collector current of 0.1A, and min DC current gain of 80. This small outline package with gull wing terminals is surface mountable for efficient assembly processes.

Median Price

$0.053

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 42,985 parts In-Stock

1+ parts

-

100+ parts

$0.053

1k+ parts

$0.044

10k+ parts

$0.039

42,985

-

$0.053

$0.044

$0.039

DigiKey

USA . 42,985 parts In-Stock

1+ parts

-

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$0.070

42,985

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$0.070

Verical

USA . 37,000 parts In-Stock

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$0.049

37,000

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$0.049

Distributors (In-Stock)

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Freelance Electronics

USA . 15 parts In-Stock

1+ parts

$0.034

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15

$0.034

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Digiode

USA . 1,382 parts In-Stock

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$0.041

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1,382

$0.041

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Chip Stock

USA . 34,000 parts In-Stock

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34,000

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Vyrian

USA . 11,403 parts In-Stock

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11,403

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Distributors (Availability)

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Corohmni

South Africa . 292 parts In-Stock

1+ parts

$0.034

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292

$0.034

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Corphita

USA . 1,062 parts In-Stock

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$0.039

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1,062

$0.039

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Component Stockers USA

USA . 32,860 parts In-Stock

1+ parts

$0.040

100+ parts

$0.040

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$0.040

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$0.040

32,860

$0.040

$0.040

$0.040

$0.040

AZTECH Wire

Italy . 494 parts In-Stock

1+ parts

$10.390

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494

$10.390

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Continental Prestige Electronics

USA . 42,985 parts In-Stock

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$0.041

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42,985

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$0.041

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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Perfect Parts

USA . 23,218 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,175 parts In-Stock

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Kulean Microsystems

USA . 3,587 parts In-Stock

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3,587

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UHIMA Technologies

Türkiye . 829 parts In-Stock

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Problanco Electronics

Mexico . 615 parts In-Stock

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615

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SupplyDigital Components

Austria . 565 parts In-Stock

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565

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TANS Electronics

Latvia . 355 parts In-Stock

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355

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Overview

Discover the MUN5237T1 by Onsemi, a high-quality Small Signal Bipolar Junction Transistor designed for switching applications. With a sleek rectangular package and gull wing terminals, this NPN transistor offers reliability and efficiency in a compact design. Manufactured by Onsemi, a trusted leader in the industry, this transistor provides customers with superior performance and value. Whether you're working on electronic projects or industrial applications, the MUN5237T1 delivers the power and versatility you need to bring your ideas to life. Experience the benefits of this innovative technology and take your projects to the next level with the MUN5237T1 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the transistor lightweight and durable, making it easy to handle and less likely to get damaged during handling or usage.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, making this transistor versatile for various applications.

Configuration: SINGLE WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design by eliminating the need for an external resistor, saving space and reducing the overall cost of the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast switching times and low power dissipation, making it efficient for switching circuits.

Surface Mount: YES

Surface mount compatibility allows for easy and efficient PCB assembly, saving time and enabling compact circuit designs.

Package Shape: RECTANGULAR

The rectangular shape provides a standard form factor for easy integration into various PCB layouts and designs.

Terminal Form: GULL WING

Gull wing terminals make soldering easier and more reliable, ensuring good electrical connections for optimal performance.

No. of Terminals: 3

Having three terminals allows for versatile connection options and flexibility in circuit configurations.

Maximum Power Dissipation (Abs): 0.31 W

With a high maximum power dissipation, this transistor can handle moderate power levels without overheating or getting damaged.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, enabling compact and efficient circuit designs.

Minimum DC Current Gain (hFE): 80

A high minimum DC current gain ensures consistent and stable amplification performance in various circuit applications.

Maximum Collector-Emitter Voltage: 50 V

With a high maximum collector-emitter voltage, this transistor can handle higher voltage levels in circuit applications.

Transistor Element Material: SILICON

Silicon transistors are known for their reliability, high conductivity, and low leakage current, ensuring long-term performance and stability.

Maximum Collector Current (IC): 0.1 A

With a maximum collector current of 0.1 A, this transistor can handle moderate current levels, making it suitable for various circuit applications.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and ensures reliable electrical connections for optimal performance.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in PCB layout and circuit design, allowing for multiple mounting options.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates the maximum time the transistor can be exposed to peak reflow temperature during soldering, ensuring proper soldering without damaging the component.

Peak Reflow Temperature °C: 235

With a peak reflow temperature of 235 °C, this transistor can withstand high-temperature soldering processes without compromising its performance.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MUN5237T1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTOR RATIO 0.47

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

80

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MUN5237T1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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