Loading...

MC10H645FNR2G

Onsemi

MC10H645FNR2G by Onsemi

MC10H645FNR2G clock driver by Onsemi has 6.2ns propagation delay, operates at 5V, and offers 9 true outputs. It is used for differential mux input conditioning in applications requiring fast signal propagation.

Median Price

$15.675

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 100 parts In-Stock

1+ parts

$43.700

100+ parts

$27.800

1k+ parts

-

10k+ parts

-

100

$43.700

$27.800

-

-

Rochester

USA . 2,416 parts In-Stock

1+ parts

-

100+ parts

$12.540

1k+ parts

$11.220

10k+ parts

$10.560

2,416

-

$12.540

$11.220

$10.560

Verical

USA . 1,426 parts In-Stock

1+ parts

-

100+ parts

$15.675

1k+ parts

$14.025

10k+ parts

$13.200

1,426

-

$15.675

$14.025

$13.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,191 parts In-Stock

1+ parts

$13.281

100+ parts

-

1k+ parts

-

10k+ parts

-

2,191

$13.281

-

-

-

Vyrian

USA . 7,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,829

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 311 parts In-Stock

1+ parts

$11.520

100+ parts

-

1k+ parts

-

10k+ parts

-

311

$11.520

-

-

-

Corphita

USA . 573 parts In-Stock

1+ parts

$12.582

100+ parts

-

1k+ parts

-

10k+ parts

-

573

$12.582

-

-

-

Corohmni

South Africa . 325 parts In-Stock

1+ parts

$12.630

100+ parts

-

1k+ parts

-

10k+ parts

-

325

$12.630

-

-

-

TANS Electronics

Latvia . 7,931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,931

-

-

-

-

SupplyDigital Components

Austria . 6,372 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,372

-

-

-

-

Problanco Electronics

Mexico . 4,446 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,446

-

-

-

-

Continental Prestige Electronics

USA . 2,473 parts In-Stock

1+ parts

-

100+ parts

$11.900

1k+ parts

-

10k+ parts

-

2,473

-

$11.900

-

-

Kulean Microsystems

USA . 1,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,056

-

-

-

-

Perfect Parts

USA . 784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

784

-

-

-

-

UHIMA Technologies

Türkiye . 496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

496

-

-

-

-

Microchip USA

USA . 299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

299

-

-

-

-

Authorized Procurement Solutions

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

GreenTree Electronics

Israel . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Enhance your electronic designs with the MC10H645FNR2G Clock Driver & Buffer from Onsemi. With a focus on quality and reliability, Onsemi is a trusted manufacturer known for delivering top-notch components. The MC10H645FNR2G is versatile and ideal for a wide range of applications. This clock driver offers fast propagation delay, superior performance, and ease of installation. Upgrade your projects with this high-value product and experience the benefits it brings to your designs. Trust Onsemi for all your electronic component needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 6.2 ns

The low propagation delay ensures accurate synchronization and timing in clock signal distribution.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the PCB.

Input Conditioning: DIFFERENTIAL MUX

The input conditioning with a differential multiplexer helps in signal integrity and noise reduction.

Package Shape: SQUARE

The square package shape facilitates easy handling and placement on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a standard power requirement in many applications.

No. of Terminals: 28

The high number of terminals allows for multiple connections and functionalities in the circuit.

Maximum I (ol): 24 Amp

The high maximum output current capability of 24A ensures compatibility with various devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for use in diverse environmental conditions.

Technology: ECL

The ECL technology ensures high-speed performance and low power consumption.

Technical Specifications

Clock Drivers & Buffers MC10H645FNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

10H

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

5.8 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.65 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H645FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20