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MC10H641FNG

Onsemi

MC10H641FNG by Onsemi

MC10H641FNG clock driver by Onsemi features 6.4 ns propagation delay, 5V supply voltage, and 9 true outputs. Ideal for applications requiring differential latched input conditioning in a square chip carrier package with J bend terminals.

Median Price

$6.312

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,024 parts In-Stock

1+ parts

-

100+ parts

$5.610

1k+ parts

$5.020

10k+ parts

$4.720

1,024

-

$5.610

$5.020

$4.720

Verical

USA . 577 parts In-Stock

1+ parts

-

100+ parts

$7.013

1k+ parts

$6.275

10k+ parts

$5.900

577

-

$7.013

$6.275

$5.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 530 parts In-Stock

1+ parts

$5.938

100+ parts

-

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530

$5.938

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Vyrian

USA . 7,242 parts In-Stock

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7,242

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Distributors (Availability)

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Corohmni

South Africa . 355 parts In-Stock

1+ parts

$5.250

100+ parts

-

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355

$5.250

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Corphita

USA . 2,035 parts In-Stock

1+ parts

$5.625

100+ parts

-

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2,035

$5.625

-

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AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$14.350

100+ parts

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281

$14.350

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QUARKTWIN TECHNOLOGY LTD

USA . 13,995 parts In-Stock

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13,995

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Problanco Electronics

Mexico . 7,497 parts In-Stock

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7,497

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SupplyDigital Components

Austria . 6,436 parts In-Stock

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6,436

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TANS Electronics

Latvia . 5,880 parts In-Stock

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5,880

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 1,999 parts In-Stock

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Microchip USA

USA . 244 parts In-Stock

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244

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UHIMA Technologies

Türkiye . 46 parts In-Stock

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46

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Perfect Parts

USA . 24 parts In-Stock

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24

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Overview

Enhance your electronic designs with the MC10H641FNG clock driver & buffer from Onsemi. This high-quality product boasts a range of applications and benefits, making it a must-have for any project. With Onsemi's reputation for excellence in manufacturing, you can trust that this chip carrier will deliver exceptional performance. Say goodbye to delays and hello to precision with a propagation delay of just 6.4 ns. Upgrade your design today and experience the value and reliability that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection, making the product suitable for various environments.

Propagation Delay At Nominal Supply: 6.4 ns

Low propagation delay ensures fast signal processing, making the product efficient for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration on circuit boards.

Input Conditioning: DIFFERENTIAL LATCHED

Differential latched input conditioning helps in reducing signal noise and maintaining signal integrity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power supplies.

Power Supplies (V): 5

The product operates efficiently with a standard power supply voltage of 5V.

No. of Terminals: 28

Having 28 terminals allows for multiple connections and interfaces, making the product versatile in use.

Maximum I (ol): 24 Amp

High maximum output current allows for driving multiple devices without the need for additional drivers.

Technology: ECL

ECL technology provides high-speed performance and low power consumption, making the product suitable for demanding applications.

Minimum fmax: 65 MHz

Having a minimum operating frequency of 65MHz ensures efficient signal processing and performance in high-speed applications.

Technical Specifications

Clock Drivers & Buffers MC10H641FNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

10H

Input Conditioning:

DIFFERENTIAL LATCHED

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

6.4 ns

Propagation Delay (tpd):

6.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.35 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Minimum fmax:

65 MHz

Trade Compliance

MC10H641FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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