Loading...

MC10EP139DW

Onsemi

MC10EP139DW by Onsemi

MC10EP139DW clock driver by Onsemi features 1.1 ns propagation delay, operates at -40 to 85 °C, and supports 3.3V nominal voltage. Ideal for industrial applications requiring differential input conditioning and ECL technology for precise timing control.

Median Price

$5.780

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,993 parts In-Stock

1+ parts

-

100+ parts

$5.160

1k+ parts

$4.620

10k+ parts

$4.340

9,993

-

$5.160

$4.620

$4.340

Avnet

USA . 9,993 parts In-Stock

1+ parts

-

100+ parts

$5.780

1k+ parts

$5.290

10k+ parts

-

9,993

-

$5.780

$5.290

-

Verical

USA . 8,939 parts In-Stock

1+ parts

-

100+ parts

$6.450

1k+ parts

$5.775

10k+ parts

$5.425

8,939

-

$6.450

$5.775

$5.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 451 parts In-Stock

1+ parts

$5.453

100+ parts

-

1k+ parts

-

10k+ parts

-

451

$5.453

-

-

-

Vyrian

USA . 8,684 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,684

-

-

-

-

ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 904 parts In-Stock

1+ parts

$5.166

100+ parts

-

1k+ parts

-

10k+ parts

-

904

$5.166

-

-

-

Corohmni

South Africa . 483 parts In-Stock

1+ parts

$5.180

100+ parts

-

1k+ parts

-

10k+ parts

-

483

$5.180

-

-

-

Component Stockers USA

USA . 11,320 parts In-Stock

1+ parts

$5.910

100+ parts

$5.550

1k+ parts

$5.010

10k+ parts

-

11,320

$5.910

$5.550

$5.010

-

AZTECH Wire

Italy . 984 parts In-Stock

1+ parts

$19.860

100+ parts

-

1k+ parts

-

10k+ parts

-

984

$19.860

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,656 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,656

-

-

-

-

Continental Prestige Electronics

USA . 9,993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,993

-

-

-

-

TANS Electronics

Latvia . 6,935 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,935

-

-

-

-

Microchip USA

USA . 4,611 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,611

-

-

-

-

Kulean Microsystems

USA . 3,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,856

-

-

-

-

SupplyDigital Components

Austria . 2,228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,228

-

-

-

-

Problanco Electronics

Mexico . 579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

579

-

-

-

-

UHIMA Technologies

Türkiye . 485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

485

-

-

-

-

Overview

Enhance your clock driver and buffer applications with the MC10EP139DW by Onsemi. Crafted with precision and quality, this product offers unparalleled performance and reliability. From its differential input conditioning to its small outline package style, this device delivers a propagation delay of just 0.9 ns, ensuring seamless operation. Ideal for industrial-grade environments, the MC10EP139DW guarantees maximum efficiency and accuracy in your systems. Trust Onsemi to provide cutting-edge technology that meets your needs every time. Elevate your projects with the MC10EP139DW and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product's longevity and stability.

Propagation Delay At Nominal Supply: 1.1 ns

Low propagation delay ensures quick and efficient signal transmission.

Surface Mount: YES

Ease of installation and space-saving design.

Input Conditioning: DIFFERENTIAL

Allows for accurate data transmission and reduces noise interference.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, making it versatile.

Power Supplies (V): -3.0/-5.5/3.3/5.0

Supports a wide range of power supply voltages for flexibility in different applications.

No. of Terminals: 20

Provides ample connection options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

Compact design for space-constrained applications.

Terminal Finish: TIN LEAD

Ensures good conductivity and solderability for reliable connections.

Maximum Operating Temperature: 85 °C

Capable of operating in relatively high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in cold temperature conditions as well.

Technical Specifications

Clock Drivers & Buffers MC10EP139DW attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-3.0/-5.5/3.3/5.0

Propagation Delay At Nominal Supply:

1.1 ns

Propagation Delay (tpd):

.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MC10EP139DW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20