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MC10EL11DTG

Onsemi

MC10EL11DTG by Onsemi

MC10EL11DTG clock driver by Onsemi features 0.385 ns propagation delay, 5V nominal voltage, and -40 to 85 °C operating temperature range. Ideal for industrial applications requiring differential input conditioning and dual terminal position in a small outline package.

Median Price

$2.530

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 421 parts In-Stock

1+ parts

$2.550

100+ parts

$2.400

1k+ parts

$2.170

10k+ parts

-

421

$2.550

$2.400

$2.170

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DigiKey

USA . 421 parts In-Stock

1+ parts

-

100+ parts

-

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$2.530

10k+ parts

$2.530

421

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$2.530

$2.530

Verical

USA . 370 parts In-Stock

1+ parts

-

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-

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$2.450

10k+ parts

$2.300

370

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-

$2.450

$2.300

Distributors (In-Stock)

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Digiode

USA . 954 parts In-Stock

1+ parts

$2.308

100+ parts

-

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954

$2.308

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Vyrian

USA . 3,993 parts In-Stock

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3,993

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DigiKey Marketplace

USA . 421 parts In-Stock

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421

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Distributors (Availability)

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Corphita

USA . 128 parts In-Stock

1+ parts

$2.187

100+ parts

-

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128

$2.187

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-

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Corohmni

South Africa . 331 parts In-Stock

1+ parts

$2.200

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-

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331

$2.200

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$27.005

100+ parts

$24.575

1k+ parts

$22.144

10k+ parts

-

500

$27.005

$24.575

$22.144

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Kulean Microsystems

USA . 6,741 parts In-Stock

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6,741

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SupplyDigital Components

Austria . 5,266 parts In-Stock

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TANS Electronics

Latvia . 4,931 parts In-Stock

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Problanco Electronics

Mexico . 4,432 parts In-Stock

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4,432

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Continental Prestige Electronics

USA . 622 parts In-Stock

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$2.070

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622

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$2.070

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Microchip USA

USA . 409 parts In-Stock

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409

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UHIMA Technologies

Türkiye . 212 parts In-Stock

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Overview

Discover the cutting-edge MC10EL11DTG clock driver and buffer from Onsemi, a leading manufacturer known for its high-quality components. Ideal for applications requiring precise timing, this product offers lightning-fast propagation delay, differential input conditioning, and a wide operating temperature range. With a compact design and reliable performance, the MC10EL11DTG is the perfect solution for demanding industrial environments. Trust Onsemi to deliver superior products that meet your needs and exceed your expectations. Experience the difference with the MC10EL11DTG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and reliable for long-term use.

Propagation Delay At Nominal Supply: 0.385 ns

Low propagation delay ensures fast and efficient signal transmission.

Surface Mount: YES

Surface mount capability makes it easy to integrate into circuits or PCBs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning allows for more accurate signal processing.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage for compatibility with various systems.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide operating temperature range of -40 °C to 85°C.

Technology: ECL

Uses ECL technology for high-speed performance and low power consumption.

Maximum Supply Voltage (Vsup): 5.7 V

Can safely operate with a maximum supply voltage of 5.7V, providing some tolerance to voltage fluctuations.

Technical Specifications

Clock Drivers & Buffers MC10EL11DTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE= -4.2V TO -5.7V

Family:

10EL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Propagation Delay At Nominal Supply:

.385 ns

Propagation Delay (tpd):

.34 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC10EL11DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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