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MC10EL05DG

Onsemi

MC10EL05DG by Onsemi

MC10EL05DG by Onsemi is a Logic Gate with 0.39 ns Propagation Delay, 2 Inputs, and 5V Nominal Voltage. Ideal for high-speed applications in industrial settings due to -40 to 85 °C operating temperature range and ECL technology. Package style is small outline with dual terminal position for surface mount assembly.

Median Price

$23.434

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 5,000 parts In-Stock

1+ parts

$23.434

100+ parts

$21.325

1k+ parts

$19.216

10k+ parts

-

5,000

$23.434

$21.325

$19.216

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Distributors (In-Stock)

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Digiode

USA . 239 parts In-Stock

1+ parts

$22.262

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239

$22.262

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Vyrian

USA . 4,184 parts In-Stock

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4,184

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ComSIT Distribution GmbH

Germany . 98 parts In-Stock

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ComSIT USA

USA . 98 parts In-Stock

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98

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Distributors (Availability)

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AZTECH Wire

Italy . 267 parts In-Stock

1+ parts

$15.240

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-

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267

$15.240

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Corphita

USA . 683 parts In-Stock

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$21.091

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683

$21.091

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$23.434

100+ parts

$21.325

1k+ parts

$19.216

10k+ parts

-

5,000

$23.434

$21.325

$19.216

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Corohmni

South Africa . 463 parts In-Stock

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$23.434

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463

$23.434

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Component Stockers USA

USA . 322 parts In-Stock

1+ parts

$99.990

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322

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Problanco Electronics

Mexico . 8,384 parts In-Stock

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SupplyDigital Components

Austria . 6,996 parts In-Stock

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TANS Electronics

Latvia . 2,254 parts In-Stock

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UHIMA Technologies

Türkiye . 430 parts In-Stock

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Microchip USA

USA . 343 parts In-Stock

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Perfect Parts

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Kulean Microsystems

USA . 107 parts In-Stock

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Overview

Upgrade your logic gate game with the MC10EL05DG from Onsemi. With a lightning-fast propagation delay of 0.44 ns, this small outline package offers top-notch performance for your industrial applications. Onsemi's reputation for quality and reliability ensures that you're getting a product you can trust. Whether you're working on telecommunications, data communications, or test equipment, this logic gate will provide the speed and precision you need to take your project to the next level. Say goodbye to delays and glitches - choose the MC10EL05DG for seamless operation and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a variety of applications.

Propagation Delay At Nominal Supply: 0.44 ns

The low propagation delay ensures fast signal processing, making this product ideal for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation on printed circuit boards, saving time and effort during assembly.

No. of Inputs: 2

Having 2 inputs provides flexibility in designing logic circuits, allowing for more complex operations to be performed.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility with a wide range of devices.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the product to be used in different environmental conditions, enhancing its versatility.

Technical Specifications

Logic Gates MC10EL05DG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

22 mA

Propagation Delay At Nominal Supply:

.44 ns

Propagation Delay (tpd):

.39 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10EL05DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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