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MC100EP08DG

Onsemi

MC100EP08DG by Onsemi

MC100EP08DG by Onsemi is a logic gate with 2 inputs, 0.3 ns propagation delay, and 3.3V nominal voltage. Ideal for industrial applications, it operates b/w -40 to 85 °C and has a max power supply current of 40 mA. This ECL technology chip comes in a small outline package with matte tin finish.

Median Price

$9.140

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$12.650

100+ parts

$9.120

1k+ parts

$8.600

10k+ parts

-

5

$12.650

$9.120

$8.600

-

Chip1Stop

Japan . 256 parts In-Stock

1+ parts

$24.700

100+ parts

$14.700

1k+ parts

-

10k+ parts

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256

$24.700

$14.700

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-

Rochester

USA . 46,656 parts In-Stock

1+ parts

-

100+ parts

$6.940

1k+ parts

$6.210

10k+ parts

$5.850

46,656

-

$6.940

$6.210

$5.850

DigiKey

USA . 46,656 parts In-Stock

1+ parts

-

100+ parts

$9.140

1k+ parts

-

10k+ parts

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46,656

-

$9.140

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Verical

USA . 14,344 parts In-Stock

1+ parts

-

100+ parts

$8.675

1k+ parts

$7.763

10k+ parts

$7.313

14,344

-

$8.675

$7.763

$7.313

Flip Electronics (Authorized)

USA . 11,760 parts In-Stock

1+ parts

-

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11,760

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-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.352

100+ parts

-

1k+ parts

-

10k+ parts

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50

$7.352

-

-

-

Digiode

USA . 626 parts In-Stock

1+ parts

$7.353

100+ parts

-

1k+ parts

-

10k+ parts

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626

$7.353

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-

-

Flip Electronics

USA . 11,760 parts In-Stock

1+ parts

-

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11,760

-

-

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Vyrian

USA . 8,179 parts In-Stock

1+ parts

-

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8,179

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R&J Components

USA . 24 parts In-Stock

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24

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 11,867 parts In-Stock

1+ parts

$6.580

100+ parts

-

1k+ parts

-

10k+ parts

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11,867

$6.580

-

-

-

Corphita

USA . 2,306 parts In-Stock

1+ parts

$6.966

100+ parts

-

1k+ parts

-

10k+ parts

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2,306

$6.966

-

-

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Continental Prestige Electronics

USA . 1,554 parts In-Stock

1+ parts

$7.352

100+ parts

-

1k+ parts

-

10k+ parts

$7.205

1,554

$7.352

-

-

$7.205

Corohmni

South Africa . 426 parts In-Stock

1+ parts

$7.740

100+ parts

-

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10k+ parts

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426

$7.740

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Component Stockers USA

USA . 31,358 parts In-Stock

1+ parts

$7.990

100+ parts

$7.520

1k+ parts

$6.800

10k+ parts

$6.800

31,358

$7.990

$7.520

$6.800

$6.800

Microchip USA

USA . 1,413 parts In-Stock

1+ parts

$34.720

100+ parts

-

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1,413

$34.720

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SupplyDigital Components

Austria . 5,978 parts In-Stock

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5,978

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TANS Electronics

Latvia . 5,305 parts In-Stock

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5,305

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Perfect Parts

USA . 2,435 parts In-Stock

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2,435

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Problanco Electronics

Mexico . 1,856 parts In-Stock

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1,856

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Kulean Microsystems

USA . 1,374 parts In-Stock

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1,374

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UHIMA Technologies

Türkiye . 956 parts In-Stock

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956

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Authorized Procurement Solutions

USA . 256 parts In-Stock

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256

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Argo Parts USA

USA . 189 parts In-Stock

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189

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Overview

Experience the next level of performance and reliability with the MC100EP08DG logic gate by Onsemi. Designed with precision and expertise, this high-quality product offers unparalleled speed and efficiency in a compact package. Ideal for a wide range of applications, this logic gate provides seamless integration and exceptional functionality. Trust Onsemi to deliver cutting-edge technology that exceeds expectations. Upgrade your systems today with the MC100EP08DG and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the logic gates, making them suitable for a variety of environments.

Propagation Delay At Nominal Supply: 0.32 ns

The low propagation delay allows for fast processing of signals, making these logic gates ideal for applications requiring high speed performance.

No. of Inputs: 2

Having two inputs allows for more complex logic operations to be performed, increasing the versatility of these logic gates.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage is commonly used in many electronic devices, making these logic gates compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, these logic gates can withstand high temperature environments without compromising performance.

Technical Specifications

Logic Gates MC100EP08DG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: 0V VCC WITH VEE = -3.0V TO -5.5V

Family:

100E

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay At Nominal Supply:

.32 ns

Propagation Delay (tpd):

.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100EP08DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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