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MC100E104FNR2G

Onsemi

MC100E104FNR2G by Onsemi

MC100E104FNR2G by Onsemi is a Logic Gates chip with 5 functions, 2 inputs, and 1ns propagation delay at 5V. It operates in temperatures from 0 to 85 °C and has a matte tin finish. Ideal for high-speed applications requiring fast signal processing.

Median Price

$8.220

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.427

10k+ parts

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1,932

-

-

$8.427

-

Rochester

USA . 500 parts In-Stock

1+ parts

-

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-

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500

-

-

-

-

Verical

USA . 269 parts In-Stock

1+ parts

-

100+ parts

$8.012

1k+ parts

$7.175

10k+ parts

$6.750

269

-

$8.012

$7.175

$6.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,786 parts In-Stock

1+ parts

-

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6,786

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Digiode

USA . 308 parts In-Stock

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308

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 1,132 parts In-Stock

1+ parts

$7.200

100+ parts

$6.770

1k+ parts

$6.120

10k+ parts

-

1,132

$7.200

$6.770

$6.120

-

Corohmni

South Africa . 441 parts In-Stock

1+ parts

$8.427

100+ parts

-

1k+ parts

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441

$8.427

-

-

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AZTECH Wire

Italy . 1,143 parts In-Stock

1+ parts

$21.950

100+ parts

-

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10k+ parts

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1,143

$21.950

-

-

-

Microchip USA

USA . 1,558 parts In-Stock

1+ parts

$22.520

100+ parts

$22.200

1k+ parts

$22.040

10k+ parts

$21.880

1,558

$22.520

$22.200

$22.040

$21.880

QUARKTWIN TECHNOLOGY LTD

USA . 28,184 parts In-Stock

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28,184

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SupplyDigital Components

Austria . 6,017 parts In-Stock

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6,017

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Kulean Microsystems

USA . 5,428 parts In-Stock

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5,428

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Problanco Electronics

Mexico . 4,928 parts In-Stock

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4,928

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TANS Electronics

Latvia . 3,226 parts In-Stock

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3,226

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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UHIMA Technologies

Türkiye . 464 parts In-Stock

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464

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Corphita

USA . 206 parts In-Stock

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206

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Overview

Experience unparalleled performance and reliability with the MC100E104FNR2G by Onsemi. As a leading manufacturer in the industry, Onsemi brings you top-quality logic gates that are essential for a wide range of applications. With a fast propagation delay of just 1 ns and 5 functions in one package, this product offers unmatched efficiency and functionality. Whether you're working on telecommunications, industrial automation, or data communications projects, this logic gate provides the value, benefits, and advantages you need to take your designs to the next level. Trust Onsemi to deliver superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can protect the components inside, making the product reliable and long-lasting.

Propagation Delay At Nominal Supply: 1 ns

Low propagation delay ensures fast signal processing, making the product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving, making the product convenient for compact designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes the product compatible with most electronic systems.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making the product efficient for demanding applications.

Technical Specifications

Logic Gates MC100E104FNR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

5

No. of Inputs:

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

53 mA

Propagation Delay At Nominal Supply:

1 ns

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.57 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.505 mm

Trade Compliance

MC100E104FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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