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MC10EL01DG

Onsemi

MC10EL01DG by Onsemi

MC10EL01DG by Onsemi is a logic gate with 4 inputs, 0.33 ns propagation delay, and -40 to 85°C operating temperature range. It is used in industrial applications requiring fast signal processing and operates at a nominal voltage of 5V.

Median Price

$7.360

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 78 parts In-Stock

1+ parts

$6.440

100+ parts

$3.800

1k+ parts

$3.650

10k+ parts

-

78

$6.440

$3.800

$3.650

-

Mouser Electronics

USA . 545 parts In-Stock

1+ parts

$7.360

100+ parts

$4.910

1k+ parts

$4.330

10k+ parts

$4.190

545

$7.360

$4.910

$4.330

$4.190

DigiKey

USA . 90 parts In-Stock

1+ parts

$7.360

100+ parts

$4.808

1k+ parts

$4.423

10k+ parts

$4.331

90

$7.360

$4.808

$4.423

$4.331

Newark

USA . 78 parts In-Stock

1+ parts

$7.580

100+ parts

$5.250

1k+ parts

$4.690

10k+ parts

-

78

$7.580

$5.250

$4.690

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Element14

Singapore . 78 parts In-Stock

1+ parts

$10.820

100+ parts

$6.370

1k+ parts

$6.330

10k+ parts

-

78

$10.820

$6.370

$6.330

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Verical

USA . 9,996 parts In-Stock

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-

100+ parts

$3.954

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9,996

-

$3.954

-

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Rochester

USA . 5,641 parts In-Stock

1+ parts

-

100+ parts

$3.930

1k+ parts

$3.520

10k+ parts

$3.310

5,641

-

$3.930

$3.520

$3.310

Flip Electronics (Authorized)

USA . 200 parts In-Stock

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-

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200

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Distributors (In-Stock)

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Digiode

USA . 2,073 parts In-Stock

1+ parts

$4.152

100+ parts

-

1k+ parts

-

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2,073

$4.152

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.499

100+ parts

-

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-

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50

$4.499

-

-

-

Flip Electronics

USA . 10,196 parts In-Stock

1+ parts

-

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10,196

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Vyrian

USA . 6,984 parts In-Stock

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-

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6,984

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-

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Elcom Components

USA . 735 parts In-Stock

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-

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735

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Semtec, LLC

USA . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,152 parts In-Stock

1+ parts

$3.710

100+ parts

-

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-

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1,152

$3.710

-

-

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Corphita

USA . 1,408 parts In-Stock

1+ parts

$3.933

100+ parts

-

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-

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1,408

$3.933

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-

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Corohmni

South Africa . 111 parts In-Stock

1+ parts

$4.370

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-

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111

$4.370

-

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Argo Parts USA

USA . 2,829 parts In-Stock

1+ parts

$4.499

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-

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2,829

$4.499

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Continental Prestige Electronics

USA . 1,896 parts In-Stock

1+ parts

$4.499

100+ parts

-

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-

10k+ parts

$4.409

1,896

$4.499

-

-

$4.409

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.499

100+ parts

-

1k+ parts

$4.274

10k+ parts

$4.184

1,000

$4.499

-

$4.274

$4.184

Microchip USA

USA . 1,199 parts In-Stock

1+ parts

$22.204

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-

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1,199

$22.204

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Lixinc

USA . 15,235 parts In-Stock

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Perfect Parts

USA . 14,030 parts In-Stock

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14,030

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Kulean Microsystems

USA . 5,481 parts In-Stock

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5,481

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TANS Electronics

Latvia . 4,723 parts In-Stock

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4,723

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Problanco Electronics

Mexico . 4,621 parts In-Stock

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4,621

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SupplyDigital Components

Austria . 1,499 parts In-Stock

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1,499

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Authorized Procurement Solutions

USA . 1,470 parts In-Stock

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1,470

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GreenTree Electronics

Israel . 1,470 parts In-Stock

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1,470

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UHIMA Technologies

Türkiye . 420 parts In-Stock

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420

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Overview

Enhance your electronic designs with the MC10EL01DG logic gate by Onsemi, a reliable and high-quality component that offers exceptional performance in various applications. Manufactured by Onsemi, a trusted leader in semiconductor technology, this logic gate features a fast propagation delay of 0.33 ns and a wide operating temperature range, making it ideal for industrial-grade projects. With its compact package style and surface mount capabilities, the MC10EL01DG is easy to integrate into your circuit design, providing efficient and accurate signal processing. Upgrade your projects today with the MC10EL01DG and experience the superior quality and reliability that Onsemi products are known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 0.37 ns

With a low propagation delay, this product ensures fast and efficient signal processing.

Surface Mount: YES

Being surface mountable, this product is easy to assemble and saves space on the PCB.

No. of Inputs: 4

Having 4 inputs allows for more complex logic operations to be performed.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes this product compatible with a wide range of systems.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can function reliably in extreme cold conditions.

Maximum Operating Temperature: 85 °C

Having a high maximum operating temperature ensures the product can withstand elevated temperatures without performance degradation.

Technology: ECL

Utilizing Emitter-Coupled Logic technology, this product offers high-speed operation and low power consumption.

Technical Specifications

Logic Gates MC10EL01DG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

4

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

17 mA

Propagation Delay At Nominal Supply:

.37 ns

Propagation Delay (tpd):

.33 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10EL01DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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