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MC100EP08DTG

Onsemi

MC100EP08DTG by Onsemi

MC100EP08DTG by Onsemi is a Logic Gate with 0.3 ns Propagation Delay, 2 Inputs, and 3.3V Nominal Voltage. Ideal for high-speed applications in industrial settings due to ECL technology and -40 to 85 °C operating temperature range. Package style is small outline, thin profile, shrink pitch with matte tin terminal finish.

Median Price

$7.850

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS Americas

USA . 8 parts In-Stock

1+ parts

$3.940

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-

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8

$3.940

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RS (Exports)

UK . 8 parts In-Stock

1+ parts

$4.940

100+ parts

-

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8

$4.940

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Chip1Stop

Japan . 60 parts In-Stock

1+ parts

$8.540

100+ parts

-

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60

$8.540

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Farnell

UK . 63 parts In-Stock

1+ parts

$10.710

100+ parts

$6.260

1k+ parts

$5.940

10k+ parts

-

63

$10.710

$6.260

$5.940

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Mouser Electronics

USA . 448 parts In-Stock

1+ parts

$11.260

100+ parts

$7.390

1k+ parts

$6.590

10k+ parts

-

448

$11.260

$7.390

$6.590

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Newark

USA . 13 parts In-Stock

1+ parts

$11.600

100+ parts

$7.620

1k+ parts

$6.770

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13

$11.600

$7.620

$6.770

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Element14

Singapore . 63 parts In-Stock

1+ parts

$16.290

100+ parts

$10.180

1k+ parts

$9.980

10k+ parts

-

63

$16.290

$10.180

$9.980

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Rochester

USA . 2,931 parts In-Stock

1+ parts

-

100+ parts

$6.280

1k+ parts

$5.620

10k+ parts

$5.290

2,931

-

$6.280

$5.620

$5.290

Verical

USA . 1,813 parts In-Stock

1+ parts

-

100+ parts

$7.850

1k+ parts

$7.025

10k+ parts

$6.612

1,813

-

$7.850

$7.025

$6.612

Arrow

USA . 217 parts In-Stock

1+ parts

-

100+ parts

$6.459

1k+ parts

$6.387

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217

-

$6.459

$6.387

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Future Electronics

Canada . 200 parts In-Stock

1+ parts

-

100+ parts

$5.880

1k+ parts

$5.780

10k+ parts

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200

-

$5.880

$5.780

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,960 parts In-Stock

1+ parts

$3.743

100+ parts

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1,960

$3.743

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Vyrian

USA . 559 parts In-Stock

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559

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NAC Semi

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$11.760

1k+ parts

$10.690

10k+ parts

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200

-

$11.760

$10.690

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IBS Electronics

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$8.443

1k+ parts

$8.177

10k+ parts

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200

-

$8.443

$8.177

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Flip Electronics

USA . 100 parts In-Stock

1+ parts

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100

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Tectiva GmbH

Germany . 100 parts In-Stock

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100

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Semtec, LLC

USA . 56 parts In-Stock

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56

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Semi Source

USA . 9 parts In-Stock

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9

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Distributors (Availability)

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Ampacity Inc.

Singapore . 435 parts In-Stock

1+ parts

$3.350

100+ parts

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435

$3.350

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Corphita

USA . 463 parts In-Stock

1+ parts

$3.546

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463

$3.546

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Corohmni

South Africa . 460 parts In-Stock

1+ parts

$3.940

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460

$3.940

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Semicontronic

India . 556 parts In-Stock

1+ parts

$7.290

100+ parts

$7.108

1k+ parts

$7.071

10k+ parts

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556

$7.290

$7.108

$7.071

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Continental Prestige Electronics

USA . 9 parts In-Stock

1+ parts

$9.140

100+ parts

$6.150

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9

$9.140

$6.150

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Allen Electronics Distributors

USA . 8 parts In-Stock

1+ parts

$12.250

100+ parts

$11.820

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8

$12.250

$11.820

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Aztec Data Supply Inc.

USA . 3,799 parts In-Stock

1+ parts

$30.740

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3,799

$30.740

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Microchip USA

USA . 9,927 parts In-Stock

1+ parts

$31.332

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9,927

$31.332

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TANS Electronics

Latvia . 7,609 parts In-Stock

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Lixinc

USA . 6,137 parts In-Stock

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Kulean Microsystems

USA . 3,833 parts In-Stock

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Problanco Electronics

Mexico . 1,844 parts In-Stock

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SupplyDigital Components

Austria . 1,294 parts In-Stock

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iodParts Technologies Inc.

India . 500 parts In-Stock

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500

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Perfect Parts

USA . 389 parts In-Stock

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389

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UHIMA Technologies

Türkiye . 224 parts In-Stock

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224

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Bastille Electronics

Australia . 200 parts In-Stock

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Argo Parts USA

USA . 184 parts In-Stock

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184

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Overview

Looking for high-quality logic gates that offer fast propagation delays and reliable performance? Look no further than the MC100EP08DTG by Onsemi. With a nominal supply voltage of 3.3V and a compact square package shape, this product is perfect for industrial applications where speed and efficiency are crucial. Say goodbye to slow response times and hello to seamless operation with the MC100EP08DTG. Upgrade your systems today and experience the difference Onsemi can make!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the product long-lasting.

Propagation Delay At Nominal Supply: 0.32 ns

With a fast propagation delay, this logic gate ensures quick signal processing, ideal for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on circuit boards, saving space and simplifying assembly.

No. of Inputs: 2

Having two inputs allows for more complex logic operations to be executed, increasing the versatility of the product.

Package Shape: SQUARE

The square shape of the package ensures efficient use of space on a circuit board, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V provides stable power to the logic gate, ensuring reliable performance.

Power Supplies (V): -4.5

The dual power supplies offer flexibility in operating voltage, allowing compatibility with a variety of systems.

No. of Terminals: 8

The eight terminals provide multiple connection points, enabling seamless integration into circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style reduces the overall size and weight of the component, making it ideal for miniaturized electronics.

Propagation Delay (tpd): 0.3 ns

With a low propagation delay, this logic gate minimizes signal lag, enhancing overall system efficiency.

Technical Specifications

Logic Gates MC100EP08DTG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: 0V VCC WITH VEE = -3.0V TO -5.5V

Family:

100E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay At Nominal Supply:

.32 ns

Propagation Delay (tpd):

.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100EP08DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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