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MC100EP01DTG

Onsemi

MC100EP01DTG by Onsemi

MC100EP01DTG by Onsemi is a logic gate with 4 inputs and 0.35 ns propagation delay at 3.3V. Operating temperature range from -40 to 85 °C, suitable for industrial applications requiring fast signal processing in compact designs. Surface mount package with small outline, thin profile, and shrink pitch makes it ideal for space-constrained PCB layouts.

Median Price

$7.987

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

1+ parts

$7.428

100+ parts

$5.979

1k+ parts

-

10k+ parts

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3

$7.428

$5.979

-

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Chip1Stop

Japan . 5 parts In-Stock

1+ parts

$9.366

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-

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5

$9.366

-

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Rochester

USA . 28,007 parts In-Stock

1+ parts

-

100+ parts

$6.390

1k+ parts

$5.720

10k+ parts

$5.380

28,007

-

$6.390

$5.720

$5.380

DigiKey

USA . 28,007 parts In-Stock

1+ parts

-

100+ parts

$8.410

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28,007

-

$8.410

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Verical

USA . 13,500 parts In-Stock

1+ parts

-

100+ parts

$7.987

1k+ parts

$7.150

10k+ parts

$6.725

13,500

-

$7.987

$7.150

$6.725

Flip Electronics (Authorized)

USA . 8,325 parts In-Stock

1+ parts

-

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8,325

-

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Distributors (In-Stock)

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Digiode

USA . 313 parts In-Stock

1+ parts

$6.745

100+ parts

-

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313

$6.745

-

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Flip Electronics

USA . 8,325 parts In-Stock

1+ parts

-

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8,325

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Vyrian

USA . 6,301 parts In-Stock

1+ parts

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6,301

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

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500

-

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IBS Electronics

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$8.387

1k+ parts

$8.233

10k+ parts

-

200

-

$8.387

$8.233

-

NAC Semi

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$11.960

1k+ parts

$10.870

10k+ parts

-

200

-

$11.960

$10.870

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Prism Electronics

USA . 26 parts In-Stock

1+ parts

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26

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Inventory MP

USA . 4 parts In-Stock

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4

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Bristol Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,999 parts In-Stock

1+ parts

$5.390

100+ parts

-

1k+ parts

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5,999

$5.390

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-

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Corohmni

South Africa . 394 parts In-Stock

1+ parts

$6.330

100+ parts

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394

$6.330

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Corphita

USA . 1,758 parts In-Stock

1+ parts

$6.390

100+ parts

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1,758

$6.390

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Component Stockers USA

USA . 37,182 parts In-Stock

1+ parts

$7.910

100+ parts

$7.430

1k+ parts

$6.710

10k+ parts

$6.710

37,182

$7.910

$7.430

$6.710

$6.710

Microchip USA

USA . 4,357 parts In-Stock

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4,357

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Continental Prestige Electronics

USA . 4,141 parts In-Stock

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Problanco Electronics

Mexico . 2,267 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Kulean Microsystems

USA . 1,751 parts In-Stock

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TANS Electronics

Latvia . 1,504 parts In-Stock

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1,504

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SupplyDigital Components

Austria . 1,231 parts In-Stock

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UHIMA Technologies

Türkiye . 876 parts In-Stock

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876

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Perfect Parts

USA . 358 parts In-Stock

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358

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Argo Parts USA

USA . 217 parts In-Stock

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217

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Kepictronics

USA . 215 parts In-Stock

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215

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GreenTree Electronics

Israel . 100 parts In-Stock

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100

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Overview

Experience top-notch performance with the MC100EP01DTG from Onsemi. As a leading manufacturer in the industry, Onsemi delivers superior quality logic gates that are ideal for a wide range of applications. With a fast propagation delay and low power consumption, this product offers exceptional value and benefits to customers. Whether you're working on telecommunications, data communications, or industrial applications, the MC100EP01DTG is the perfect choice for reliable and efficient operation. Trust Onsemi to provide innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material ensures durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 0.35 ns

Low propagation delay ensures fast response time and efficient operation of the logic gates.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation of the logic gates on circuit boards.

No. of Inputs: 4

Four inputs provide flexibility in logic operations and allow for more complex functions to be implemented.

Nominal Supply Voltage / Vsup (V): 3.3

Stable and efficient supply voltage ensures reliable performance of the logic gates.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for use in various environments without risking damage to the logic gates.

Technology: ECL

ECL technology offers high-speed performance and low power consumption for the logic gates.

Technical Specifications

Logic Gates MC100EP01DTG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inputs:

4

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

.35 ns

Propagation Delay (tpd):

.33 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100EP01DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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