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MC10H117P

Onsemi

MC10H117P by Onsemi

MC10H117P by Onsemi is a Logic Gates IC with 2 functions and 5 inputs. It has a propagation delay of 1.35 ns at -5.2V, suitable for high-speed applications in commercial extended temperature environments. The package style is in-line, making it ideal for through-hole mounting on PCBs.

Median Price

$1.165

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 2,237 parts In-Stock

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-

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$1.260

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$1.050

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$0.932

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$0.932

DigiKey

USA . 2,237 parts In-Stock

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$1.070

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Farnell

UK . 2,237 parts In-Stock

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$1.040

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Verical

USA . 2,237 parts In-Stock

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$1.313

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$1.165

2,237

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$1.165

Distributors (In-Stock)

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Nova Conductors

Japan . 71 parts In-Stock

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$0.978

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Digiode

USA . 125 parts In-Stock

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Forefront Electronics and Design

USA . 8 parts In-Stock

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$2.450

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Vyrian

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Electronic Expediters

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Inland Empire Components Inc.

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675

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Standard Data Resources

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625

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Prism Electronics

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Dan-Mar Components

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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J2 Sourcing AB

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Mil-Aero Solutions, Inc.

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Holdelec - ElecDif-Pro

France . 24 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 20 parts In-Stock

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A2Z Electronics, Inc.

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Q Components

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Electro Mavin

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Century Electronics Ltd.

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,872 parts In-Stock

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$0.880

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Corphita

USA . 1,613 parts In-Stock

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$0.927

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Argo Parts USA

USA . 3,452 parts In-Stock

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Corohmni

South Africa . 485 parts In-Stock

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$1.030

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Aztec Data Supply Inc.

USA . 890 parts In-Stock

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$15.049

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QUARKTWIN TECHNOLOGY LTD

USA . 9,281 parts In-Stock

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TANS Electronics

Latvia . 7,180 parts In-Stock

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SupplyDigital Components

Austria . 6,755 parts In-Stock

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Kulean Microsystems

USA . 4,695 parts In-Stock

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Continental Prestige Electronics

USA . 2,237 parts In-Stock

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$0.893

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Netroflash

USA . 1,000 parts In-Stock

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$0.958

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$0.929

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$0.909

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UHIMA Technologies

Türkiye . 963 parts In-Stock

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Perfect Parts

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Microchip USA

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Problanco Electronics

Mexico . 365 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Assy Fe

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Overview

Experience unmatched performance with the MC10H117P logic gate by Onsemi. Manufactured with precision and expertise, this high-quality product boasts a fast propagation delay of 1.5 ns, making it perfect for applications that require quick response times. With its compact package body material and dual terminal position, the MC10H117P offers convenience and versatility in various electronic projects. Trust Onsemi's reputation for reliability and innovation, and unlock the potential of your designs with the exceptional value and benefits of the MC10H117P logic gate.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 1.5 ns

Low propagation delay allows for fast signal processing, making these logic gates suitable for high-speed applications.

No. of Functions: 2

Having multiple functions in one package saves space and simplifies circuit design.

No. of Inputs: 5

With a high number of inputs, these logic gates can accommodate complex logic operations and larger circuits.

Nominal Supply Voltage / Vsup (V): -5.2

This voltage supply range is common and compatible with many systems, making integration easier.

Maximum Operating Temperature: 75 °C

With a high operating temperature range, these logic gates can withstand harsh environmental conditions.

Terminal Finish: TIN LEAD

Tin lead finish ensures good conductivity and reliability in the connections.

Technical Specifications

Logic Gates MC10H117P attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

COMMON INPUT

Family:

10H

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Logic IC Type:

No. of Functions:

2

No. of Inputs:

5

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Propagation Delay At Nominal Supply:

1.5 ns

Propagation Delay (tpd):

1.35 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.44 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

MC10H117P Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-368-1406, 5962013681406

NIIN

013681406

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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