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MC100E107FN

Onsemi

MC100E107FN by Onsemi

MC100E107FN by Onsemi is a logic gate with 5 functions, 2 inputs, and propagation delay of 0.6 ns at 5V. It operates in the temperature range of 0-85 °C and has a max supply voltage of 5.7V. Ideal for high-speed applications requiring fast signal processing in electronic circuits.

Median Price

$3.522

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 565 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

565

-

$3.130

$2.800

$2.630

Verical

USA . 565 parts In-Stock

1+ parts

-

100+ parts

$3.913

1k+ parts

$3.500

10k+ parts

$3.288

565

-

$3.913

$3.500

$3.288

Distributors (In-Stock)

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Freelance Electronics

USA . 25 parts In-Stock

1+ parts

$2.896

100+ parts

$3.041

1k+ parts

$2.867

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-

25

$2.896

$3.041

$2.867

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Digiode

USA . 864 parts In-Stock

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$3.296

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$3.296

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Vyrian

USA . 2,014 parts In-Stock

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$3.470

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$3.470

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Forefront Electronics and Design

USA . 5 parts In-Stock

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$24.500

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5

$24.500

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ComSIT Distribution GmbH

Germany . 306 parts In-Stock

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ECAB

Sweden . 290 parts In-Stock

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Q Components

USA . 204 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 134 parts In-Stock

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Electronic Expediters

USA . 98 parts In-Stock

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R&J Components

USA . 45 parts In-Stock

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Inventory MP

USA . 38 parts In-Stock

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Bristol Electronics

USA . 38 parts In-Stock

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Semi Source

USA . 28 parts In-Stock

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28

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Fibra_Brandt Electronic GMBH

Germany . 17 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 389 parts In-Stock

1+ parts

$2.896

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389

$2.896

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Corphita

USA . 2,103 parts In-Stock

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$3.123

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Perfect Parts

USA . 10,080 parts In-Stock

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SupplyDigital Components

Austria . 6,680 parts In-Stock

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Kulean Microsystems

USA . 6,354 parts In-Stock

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TANS Electronics

Latvia . 4,738 parts In-Stock

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Problanco Electronics

Mexico . 4,219 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Kepictronics

USA . 2,030 parts In-Stock

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Assy Fe

Spain . 1,021 parts In-Stock

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UHIMA Technologies

Türkiye . 976 parts In-Stock

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976

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Continental Prestige Electronics

USA . 565 parts In-Stock

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$3.010

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$3.010

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Microchip USA

USA . 389 parts In-Stock

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389

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Overview

Enhance your electronic projects with the MC100E107FN logic gates by Onsemi, known for their superior quality and reliability. With a fast propagation delay of just 1ns, this chip carrier package offers 5 functions and 2 inputs, making it ideal for a wide range of applications. From telecommunications to industrial automation, this versatile component provides value and efficiency to your designs. Trust Onsemi for cutting-edge technology and seamless integration in your next project.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 1 ns

Low propagation delay ensures quick response time for logical operations, making this product suitable for high-speed applications.

No. of Functions: 5

Multiple functions in a single component provide versatility and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at standard voltage levels, making it compatible with common power supplies.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliable performance in varying environments.

Technology: ECL

Uses Emitter-Coupled Logic technology known for high-speed operation and low power consumption, ideal for demanding applications.

Technical Specifications

Logic Gates MC100E107FN attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

5

No. of Inputs:

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

58 mA

Propagation Delay At Nominal Supply:

1 ns

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.57 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E107FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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