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MC100E101FNG

Onsemi

MC100E101FNG by Onsemi

MC100E101FNG by Onsemi is a logic gate with 4 functions and inputs, operating at 5V. It offers fast propagation delay of 0.5ns and ECL technology, suitable for high-speed applications in electronics. With surface mount capability and compact chip carrier package style, it ensures efficient performance in various electronic systems.

Median Price

$7.032

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,792 parts In-Stock

1+ parts

-

100+ parts

$6.250

1k+ parts

$5.590

10k+ parts

$5.260

1,792

-

$6.250

$5.590

$5.260

Verical

USA . 1,792 parts In-Stock

1+ parts

-

100+ parts

$7.813

1k+ parts

$6.987

10k+ parts

$6.575

1,792

-

$7.813

$6.987

$6.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,673 parts In-Stock

1+ parts

$6.612

100+ parts

-

1k+ parts

-

10k+ parts

-

1,673

$6.612

-

-

-

Vyrian

USA . 5,323 parts In-Stock

1+ parts

-

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-

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10k+ parts

-

5,323

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,351 parts In-Stock

1+ parts

$6.264

100+ parts

-

1k+ parts

-

10k+ parts

-

2,351

$6.264

-

-

-

Corohmni

South Africa . 158 parts In-Stock

1+ parts

$6.960

100+ parts

-

1k+ parts

-

10k+ parts

-

158

$6.960

-

-

-

AZTECH Wire

Italy . 881 parts In-Stock

1+ parts

$20.460

100+ parts

-

1k+ parts

-

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-

881

$20.460

-

-

-

TANS Electronics

Latvia . 8,339 parts In-Stock

1+ parts

-

100+ parts

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8,339

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QUARKTWIN TECHNOLOGY LTD

USA . 6,972 parts In-Stock

1+ parts

-

100+ parts

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6,972

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-

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Microchip USA

USA . 5,964 parts In-Stock

1+ parts

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5,964

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Continental Prestige Electronics

USA . 1,792 parts In-Stock

1+ parts

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1,792

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SupplyDigital Components

Austria . 621 parts In-Stock

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621

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Kulean Microsystems

USA . 379 parts In-Stock

1+ parts

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379

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UHIMA Technologies

Türkiye . 249 parts In-Stock

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249

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Problanco Electronics

Mexico . 83 parts In-Stock

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83

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Overview

Upgrade your logic gate game with the MC100E101FNG by Onsemi. Known for their top-quality products, Onsemi delivers reliable solutions that meet the needs of various applications. This versatile chip carrier logic gate offers fast propagation delay, making it ideal for high-speed circuit designs. With 4 functions and 4 inputs, this square-shaped device is perfect for demanding projects that require precision and efficiency. Trust Onsemi to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 0.5 ns

The low propagation delay ensures fast operation and efficient performance.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on circuit boards.

No. of Functions: 4

With 4 functions in one package, this product offers versatility and cost-effectiveness.

No. of Inputs: 4

The ample inputs allow for a variety of input signals to be processed.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with most systems.

Maximum Operating Temperature: 85 °C

The high operating temperature tolerance allows for reliable performance in a range of environments.

Technology: ECL

The use of Emitter-Coupled Logic technology offers fast operation and high noise immunity.

Maximum Power Supply Current (ICC): 42 mA

The low power supply current consumption helps in reducing overall power consumption of the system.

Technical Specifications

Logic Gates MC100E101FNG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

4

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

42 mA

Propagation Delay At Nominal Supply:

.5 ns

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.57 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

11.505 mm

Trade Compliance

MC100E101FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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