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MC10E211FNG

Onsemi

MC10E211FNG by Onsemi

MC10E211FNG clock driver by Onsemi features 1.2 ns propagation delay, 5V nominal voltage, and -5.2V power supplies. Ideal for applications requiring differential mux input conditioning in a square chip carrier package style.

Median Price

$4.990

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22 parts In-Stock

1+ parts

-

100+ parts

$4.990

1k+ parts

$4.460

10k+ parts

$4.200

22

-

$4.990

$4.460

$4.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,876 parts In-Stock

1+ parts

$5.282

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-

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1,876

$5.282

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Vyrian

USA . 3,206 parts In-Stock

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3,206

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Distributors (Availability)

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Corphita

USA . 392 parts In-Stock

1+ parts

$5.004

100+ parts

-

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392

$5.004

-

-

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Corohmni

South Africa . 383 parts In-Stock

1+ parts

$5.020

100+ parts

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383

$5.020

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Component Stockers USA

USA . 19 parts In-Stock

1+ parts

$5.670

100+ parts

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19

$5.670

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AZTECH Wire

Italy . 568 parts In-Stock

1+ parts

$9.600

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568

$9.600

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Kulean Microsystems

USA . 5,194 parts In-Stock

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5,194

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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TANS Electronics

Latvia . 3,049 parts In-Stock

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3,049

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QUARKTWIN TECHNOLOGY LTD

USA . 2,481 parts In-Stock

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Microchip USA

USA . 2,316 parts In-Stock

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Problanco Electronics

Mexico . 1,862 parts In-Stock

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1,862

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SupplyDigital Components

Austria . 1,779 parts In-Stock

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1,779

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UHIMA Technologies

Türkiye . 237 parts In-Stock

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Continental Prestige Electronics

USA . 22 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the MC10E211FNG clock driver and buffer by Onsemi. Designed with precision and quality in mind, this product offers unparalleled performance and reliability. With a wide range of applications in industries such as telecommunications and data communications, this chip carrier package is sure to enhance the functionality of your systems. Experience faster signal propagation and improved input conditioning with this differential mux, all while enjoying the benefits of Onsemi's superior manufacturing standards. Upgrade your technology with the MC10E211FNG and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to external factors, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 1.2 ns

Low propagation delay ensures fast signal processing and efficient operation of the clock driver.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning enhances signal accuracy and minimizes noise interference, ensuring reliable performance.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, compatible with most electronic systems and simplifying integration.

Power Supplies (V): -5.2

Supports negative power supplies, allowing for versatile power configurations in different applications.

No. of Terminals: 28

Multiple terminals provide connectivity options for various input and output signals, enhancing flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good thermal performance and mechanical protection, ensuring stable operation under varying conditions.

Output Characteristics: OPEN-EMITTER

Open-emitter output configuration allows for flexible interfacing with other components, enabling customization and compatibility with different systems.

Technology: ECL

ECL technology provides high-speed operation and low power consumption, suitable for demanding clock driver applications.

Technical Specifications

Clock Drivers & Buffers MC10E211FNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0 WITH VEE = -4.2V TO -5.7V

Family:

10E

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Propagation Delay At Nominal Supply:

1.2 ns

Propagation Delay (tpd):

1.125 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10E211FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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