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MC10E111FNR2G

Onsemi

MC10E111FNR2G by Onsemi

MC10E111FNR2G clock driver by Onsemi features 0.66ns propagation delay, 5V nominal voltage, and -40 to 85 °C operating temperature range. Ideal for industrial applications requiring differential input conditioning and 3-STATE output characteristics in a compact chip carrier package.

Median Price

$6.938

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 270 parts In-Stock

1+ parts

$14.100

100+ parts

$8.920

1k+ parts

-

10k+ parts

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270

$14.100

$8.920

-

-

Rochester

USA . 8,238 parts In-Stock

1+ parts

-

100+ parts

$5.560

1k+ parts

$4.970

10k+ parts

$4.680

8,238

-

$5.560

$4.970

$4.680

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$6.938

1k+ parts

$6.200

10k+ parts

$5.838

4,000

-

$6.938

$6.200

$5.838

Flip Electronics (Authorized)

USA . 2,516 parts In-Stock

1+ parts

-

100+ parts

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2,516

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Distributors (In-Stock)

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Digiode

USA . 908 parts In-Stock

1+ parts

$5.871

100+ parts

-

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908

$5.871

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Vyrian

USA . 6,469 parts In-Stock

1+ parts

-

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6,469

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Flip Electronics

USA . 2,516 parts In-Stock

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2,516

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 723 parts In-Stock

1+ parts

$5.562

100+ parts

-

1k+ parts

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10k+ parts

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723

$5.562

-

-

-

Corohmni

South Africa . 330 parts In-Stock

1+ parts

$5.590

100+ parts

-

1k+ parts

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10k+ parts

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330

$5.590

-

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Component Stockers USA

USA . 11,508 parts In-Stock

1+ parts

$6.390

100+ parts

$6.010

1k+ parts

$5.430

10k+ parts

-

11,508

$6.390

$6.010

$5.430

-

AZTECH Wire

Italy . 996 parts In-Stock

1+ parts

$20.650

100+ parts

-

1k+ parts

-

10k+ parts

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996

$20.650

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Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$36.782

100+ parts

$33.472

1k+ parts

$30.161

10k+ parts

-

870

$36.782

$33.472

$30.161

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Continental Prestige Electronics

USA . 8,260 parts In-Stock

1+ parts

-

100+ parts

$5.260

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8,260

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$5.260

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Kulean Microsystems

USA . 6,661 parts In-Stock

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6,661

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Microchip USA

USA . 5,933 parts In-Stock

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TANS Electronics

Latvia . 4,105 parts In-Stock

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Perfect Parts

USA . 3,055 parts In-Stock

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3,055

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Problanco Electronics

Mexico . 2,748 parts In-Stock

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2,748

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UHIMA Technologies

Türkiye . 600 parts In-Stock

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600

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SupplyDigital Components

Austria . 322 parts In-Stock

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322

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Authorized Procurement Solutions

USA . 270 parts In-Stock

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270

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GreenTree Electronics

Israel . 270 parts In-Stock

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270

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Overview

Experience the unparalleled quality and reliability of Onsemi with the MC10E111FNR2G Clock Drivers & Buffers. This innovative chip carrier package offers a fast propagation delay of just 0.68 ns, ensuring precise timing for your applications. With differential input conditioning and 3-STATE output characteristics, this device is perfect for a wide range of industrial settings. Trust in Onsemi's expertise and elevate your projects with the MC10E111FNR2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the package lightweight and durable, making it easy to handle and resistant to damage during transportation and installation.

Propagation Delay At Nominal Supply: 0.66 ns

The low propagation delay ensures fast signal processing, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Being surface mountable makes this product easy to integrate onto circuit boards and saves space, making it ideal for compact electronic devices.

Input Conditioning: DIFFERENTIAL

The use of differential input conditioning helps in reducing noise and improving signal integrity, making this product suitable for high-performance applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is commonly used in many electronic systems, making this product compatible with a wide range of applications.

Power Supplies (V): -5.2

The availability of negative power supply voltages allows this product to support a wider range of voltage requirements in electronic circuits.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides good thermal conduction and electrical performance, making this product suitable for high-frequency applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow the outputs to be in three states - high, low, and high impedance, providing flexibility in controlling connected devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making this product suitable for industrial applications.

Technology: ECL

The use of Emitter-Coupled Logic (ECL) technology offers high-speed performance and low power consumption, making this product suitable for high-speed applications.

Technical Specifications

Clock Drivers & Buffers MC10E111FNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0 V WITH VEE = -4.2 V TO -5.7 V

Family:

10E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Propagation Delay At Nominal Supply:

.66 ns

Propagation Delay (tpd):

.68 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.505 mm

Trade Compliance

MC10E111FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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