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MC100LVEP14DT

Onsemi

MC100LVEP14DT by Onsemi

MC100LVEP14DT clock driver by Onsemi has a propagation delay of 0.475 ns, operates at -40 to 85°C, and supports a max frequency of 2000 MHz. Ideal for industrial applications requiring differential mux input conditioning in a compact thin profile package.

Median Price

$6.930

Lifecycle Status

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Avnet

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Right Parts Inc.

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LIBRA Elektronik GmbH

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Corohmni

South Africa . 361 parts In-Stock

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AZTECH Wire

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Overview

Enhance the performance and reliability of your clock distribution system with the MC100LVEP14DT by Onsemi. As a leader in clock drivers & buffers, Onsemi offers cutting-edge technology and exceptional quality in every product. The MC100LVEP14DT is designed to provide fast signal propagation and precise output characteristics, making it perfect for high-speed applications. Trust Onsemi to deliver value, benefits, and advantages that will elevate your project to the next level. Experience the difference with the MC100LVEP14DT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the clock driver, ensuring durability and reliability.

Propagation Delay At Nominal Supply: 0.525 ns

Low propagation delay enables fast signal processing, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and assembly time.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexing helps in reducing noise and interference, enhancing the signal quality and overall performance of the clock driver.

Nominal Supply Voltage / Vsup (V): 2.5

This voltage level is common and widely compatible with many electronic systems, making integration easier.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this clock driver can withstand harsh environmental conditions and ensure stable performance.

Technology: ECL

Emitter-Coupled Logic (ECL) technology offers high-speed operation and low power consumption, making this clock driver suitable for demanding applications.

Technical Specifications

Clock Drivers & Buffers MC100LVEP14DT attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay At Nominal Supply:

.525 ns

Propagation Delay (tpd):

.475 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

2000 MHz

Trade Compliance

MC100LVEP14DT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-595-5192, 5962015955192, 5962-01-576-9019, 5962015769019

NIIN

015955192, 015769019

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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