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MC100LVEL37DWR2G

Onsemi

MC100LVEL37DWR2G by Onsemi

MC100LVEL37DWR2G by Onsemi is a Clock Driver with 20 terminals, ECL technology, and 0.94 ns propagation delay. It operates at -40 to 85 °C, with +-3.3V power supplies for applications requiring high-speed signal transmission in industrial settings.

Median Price

$6.244

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 128 parts In-Stock

1+ parts

-

100+ parts

$5.550

1k+ parts

$4.960

10k+ parts

$4.670

128

-

$5.550

$4.960

$4.670

Verical

USA . 128 parts In-Stock

1+ parts

-

100+ parts

$6.938

1k+ parts

-

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128

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$6.938

-

-

Distributors (In-Stock)

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Digiode

USA . 1,263 parts In-Stock

1+ parts

$5.871

100+ parts

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1,263

$5.871

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Vyrian

USA . 8,846 parts In-Stock

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8,846

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Bristol Electronics

USA . 1,415 parts In-Stock

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1,415

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Lantek

USA . 328 parts In-Stock

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328

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Distributors (Availability)

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Ampacity Inc.

Singapore . 128 parts In-Stock

1+ parts

$4.750

100+ parts

-

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128

$4.750

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Corphita

USA . 2,281 parts In-Stock

1+ parts

$5.562

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2,281

$5.562

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Corohmni

South Africa . 101 parts In-Stock

1+ parts

$5.590

100+ parts

-

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101

$5.590

-

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Component Stockers USA

USA . 139 parts In-Stock

1+ parts

$6.340

100+ parts

$5.970

1k+ parts

-

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139

$6.340

$5.970

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AZTECH Wire

Italy . 39 parts In-Stock

1+ parts

$21.030

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39

$21.030

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Kulean Microsystems

USA . 8,345 parts In-Stock

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8,345

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Problanco Electronics

Mexico . 7,941 parts In-Stock

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TANS Electronics

Latvia . 6,564 parts In-Stock

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SupplyDigital Components

Austria . 3,404 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Kepictronics

USA . 1,578 parts In-Stock

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1,578

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UHIMA Technologies

Türkiye . 851 parts In-Stock

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851

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GreenTree Electronics

Israel . 328 parts In-Stock

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328

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Continental Prestige Electronics

USA . 128 parts In-Stock

1+ parts

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100+ parts

$5.260

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128

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$5.260

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Microchip USA

USA . 127 parts In-Stock

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127

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Overview

Enhance the performance of your clocking systems with the MC100LVEL37DWR2G by Onsemi. Crafted with precision and reliability, this clock driver and buffer ensures seamless operation in a variety of applications. With a compact design and superior technology, this product delivers unmatched value and benefits to customers looking for top-notch quality and efficiency. Trust Onsemi to provide you with the cutting-edge solutions you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard power supply voltages.

Propagation Delay (tpd): 0.94 ns

Provides fast signal processing for improved performance.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

Terminal Finish: TIN

Ensures good electrical conductivity and corrosion resistance.

No. of True Outputs: 4

Offers multiple output signals for versatile functionality.

Technical Specifications

Clock Drivers & Buffers MC100LVEL37DWR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE= -3V TO -3.8V

Family:

100LVEL

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-3.3

Propagation Delay (tpd):

.94 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MC100LVEL37DWR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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