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MC100LVE222FAG

Onsemi

MC100LVE222FAG by Onsemi

MC100LVE222FAG clock driver by Onsemi has 1.32 ns propagation delay, operates at -40 to 85 °C, and supports up to 1500 MHz fmax. Ideal for industrial applications requiring differential mux input conditioning in a compact FLATPACK package with low profile design.

Median Price

$9.821

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,072 parts In-Stock

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-

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$8.730

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$7.810

10k+ parts

$7.350

4,072

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$8.730

$7.810

$7.350

Verical

USA . 1,684 parts In-Stock

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$10.912

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$9.762

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$9.188

1,684

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$10.912

$9.762

$9.188

Distributors (In-Stock)

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Digiode

USA . 171 parts In-Stock

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$9.234

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Vyrian

USA . 2,697 parts In-Stock

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Connector Distribution Corp

USA . 187 parts In-Stock

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Right Parts Inc.

USA . 187 parts In-Stock

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Sea View Technologies

USA . 156 parts In-Stock

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

France . 136 parts In-Stock

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PC Components Company LLC

USA . 117 parts In-Stock

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EMSNET

USA . 50 parts In-Stock

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Classic Components Corporation

USA . 1 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,949 parts In-Stock

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$7.470

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$7.470

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Corphita

USA . 985 parts In-Stock

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$8.748

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$8.748

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Corohmni

South Africa . 297 parts In-Stock

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$8.790

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297

$8.790

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Component Stockers USA

USA . 5,146 parts In-Stock

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$9.790

100+ parts

$9.210

1k+ parts

$8.330

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5,146

$9.790

$9.210

$8.330

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AZTECH Wire

Italy . 43 parts In-Stock

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$13.720

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Perfect Parts

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SupplyDigital Components

Austria . 4,294 parts In-Stock

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Continental Prestige Electronics

USA . 4,072 parts In-Stock

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$8.280

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Kulean Microsystems

USA . 1,583 parts In-Stock

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UHIMA Technologies

Türkiye . 882 parts In-Stock

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TANS Electronics

Latvia . 804 parts In-Stock

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Kepictronics

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Microchip USA

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Problanco Electronics

Mexico . 281 parts In-Stock

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Authorized Procurement Solutions

USA . 136 parts In-Stock

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Overview

Enhance your clock driver and buffer applications with the MC100LVE222FAG by Onsemi. This high-quality product offers superior performance, reliability, and precision for your projects. With its advanced technology and innovative design, Onsemi delivers unmatched value and benefits to customers seeking efficient and dependable solutions. Experience seamless operation and enhanced productivity with the MC100LVE222FAG, setting a new standard in clock drivers and buffers. Elevate your performance with Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection to the internal components of the clock driver & buffers, making it suitable for various applications.

Propagation Delay At Nominal Supply: 1.32 ns

Low propagation delay ensures fast and efficient clock distribution, resulting in accurate timing synchronization in electronic systems.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Input Conditioning: DIFFERENTIAL MUX

The differential multiplexer input conditioning helps in cleaning up and stabilizing the incoming clock signals, ensuring reliable and consistent performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard nominal supply voltage of 3.3V, enabling compatibility with a wide range of electronic systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this clock driver & buffers can withstand elevated temperatures, suitable for industrial environments.

Technology: ECL

Utilizing Emitter-Coupled Logic technology ensures high-speed operation and low power consumption, making it an efficient choice for clock distribution applications.

Technical Specifications

Clock Drivers & Buffers MC100LVE222FAG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0V WITH VEE = -3V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3

Length:

10 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3/-5

Propagation Delay At Nominal Supply:

1.32 ns

Propagation Delay (tpd):

1.33 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.7 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Minimum fmax:

1500 MHz

Trade Compliance

MC100LVE222FAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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