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MC100EP14DTG

Onsemi

MC100EP14DTG by Onsemi

MC100EP14DTG clock driver by Onsemi features 0.6ns propagation delay, 3.3V nominal voltage, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring high-speed signal conditioning in a compact small outline package.

Median Price

$10.430

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,699 parts In-Stock

1+ parts

$8.370

100+ parts

$8.200

1k+ parts

$8.040

10k+ parts

-

4,699

$8.370

$8.200

$8.040

-

DigiKey

USA . 95 parts In-Stock

1+ parts

$10.430

100+ parts

$7.063

1k+ parts

$6.462

10k+ parts

$6.316

95

$10.430

$7.063

$6.462

$6.316

Chip1Stop

Japan . 5 parts In-Stock

1+ parts

$11.088

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-

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5

$11.088

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NAC Semi

USA . 46 parts In-Stock

1+ parts

$8.160

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46

$8.160

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Nova Conductors

Japan . 41 parts In-Stock

1+ parts

$8.220

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-

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41

$8.220

-

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Digiode

USA . 98 parts In-Stock

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$10.534

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98

$10.534

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Vyrian

USA . 5,752 parts In-Stock

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5,752

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Flip Electronics

USA . 675 parts In-Stock

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675

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NexGen Digital

USA . 269 parts In-Stock

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269

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Prism Electronics

USA . 132 parts In-Stock

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132

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Goldney Electronics S.L.

Spain . 27 parts In-Stock

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Executive Electronics, Inc.

USA . 20 parts In-Stock

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20

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Semi Source

USA . 7 parts In-Stock

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7

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Distributors (Availability)

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Benley Electronics

USA . 81 parts In-Stock

1+ parts

$0.400

100+ parts

-

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81

$0.400

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

$8.220

100+ parts

$8.056

1k+ parts

$7.809

10k+ parts

$7.645

100

$8.220

$8.056

$7.809

$7.645

Ampacity Inc.

Singapore . 211 parts In-Stock

1+ parts

$9.420

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211

$9.420

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Corphita

USA . 2,062 parts In-Stock

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$9.979

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2,062

$9.979

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Corohmni

South Africa . 442 parts In-Stock

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$11.088

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442

$11.088

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AZTECH Wire

Italy . 604 parts In-Stock

1+ parts

$12.981

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604

$12.981

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Component Stockers USA

USA . 8 parts In-Stock

1+ parts

$15.650

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8

$15.650

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Lixinc

USA . 14,886 parts In-Stock

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RC Electronics

USA . 10,412 parts In-Stock

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iodParts Technologies Inc.

India . 8,022 parts In-Stock

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TANS Electronics

Latvia . 7,107 parts In-Stock

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Problanco Electronics

Mexico . 5,456 parts In-Stock

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SupplyDigital Components

Austria . 4,378 parts In-Stock

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Microchip USA

USA . 3,620 parts In-Stock

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Perfect Parts

USA . 2,255 parts In-Stock

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Kulean Microsystems

USA . 1,075 parts In-Stock

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UHIMA Technologies

Türkiye . 531 parts In-Stock

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531

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 33 parts In-Stock

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Fairview Electronics Ltd

UK . 3 parts In-Stock

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3

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Overview

Enhance your clock signal with the MC100EP14DTG by Onsemi, a reliable choice for clock drivers and buffers. Onsemi is known for its high-quality products, and this one is no exception. Ideal for applications requiring precise timing, this device offers a fast propagation delay of just 0.6 ns, ensuring optimal performance. With differential mux input conditioning and 5 true outputs, this product provides exceptional value and versatility. Trust Onsemi to deliver top-notch solutions for all your clock driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Propagation Delay At Nominal Supply: 0.6 ns

With a low propagation delay, this product ensures fast and efficient signal transmission.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

Input Conditioning: DIFFERENTIAL MUX

The differential mux input conditioning provides accurate and reliable data transmission.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient and space-saving integration into circuit designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, this product offers compatibility with various systems.

Power Supplies (V): -4.5

With power supplies of -4.5V, this product is suitable for applications requiring negative voltage support.

No. of Terminals: 20

The 20 terminals allow for versatile connectivity options and flexibility in system design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style with shrink pitch helps in space-constrained applications.

Propagation Delay (tpd): 0.45 ns

The low propagation delay of 0.45 ns ensures fast signal processing and minimal signal skew.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product ensures reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Operating efficiently even at a minimum temperature of -40°C, this product is suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and resistance to corrosion.

Terminal Position: DUAL

The dual terminal position enhances the stability and reliability of the connections.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, this product is suitable for compact designs with height constraints.

Width: 4.4 mm

The 4.4 mm width of this product allows for easy integration into a circuit layout.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3V, this product ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures safe and efficient assembly processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product withstands high-temperature soldering processes.

Length: 6.5 mm

The 6.5 mm length of this product provides a compact footprint for space-saving designs.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade rating, this product is designed for reliable operation in industrial applications.

Technology: ECL

The ECL technology used in this product ensures high-speed and low-power circuit operation.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during installation.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for precise and secure connections in the circuit layout.

Maximum Same Edge Skew (tskwd): 0.045 ns

The low maximum same edge skew of 0.045 ns ensures accurate and synchronized signal transmission.

No. of True Outputs: 5

With 5 true outputs, this product offers versatile signal distribution capabilities.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V, this product provides a wide operating voltage range for flexibility in power requirements.

Technical Specifications

Clock Drivers & Buffers MC100EP14DTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay At Nominal Supply:

.6 ns

Propagation Delay (tpd):

.45 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.045 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MC100EP14DTG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-631-1514, 5962016311514

NIIN

016311514

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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