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MC100EP14DT

Onsemi

MC100EP14DT by Onsemi

MC100EP14DT clock driver by Onsemi features 0.6ns propagation delay, 3.3V nominal voltage, and 5 true outputs. Ideal for industrial applications requiring differential mux input conditioning in a small outline package with surface mount capability.

Median Price

$11.220

Lifecycle Status

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15

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1k+

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Master Electronics

USA . 184 parts In-Stock

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Vyrian

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Rapid Electronics

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Semi Source

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Sunrise Surplus Inc.

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LWI Electronics Inc

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J2 Sourcing AB

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ACDS - Activité Composants Distribution Service

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Sensible Micro Corp

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QIE Inc.

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Legend Electronics Inc.

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Benley Electronics

USA . 25 parts In-Stock

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AZTECH Wire

Italy . 94 parts In-Stock

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Corohmni

South Africa . 484 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

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Metaverse IC Inc.

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Overview

Enhance your electronic designs with the MC100EP14DT clock driver from Onsemi. Known for their high-quality components, Onsemi delivers reliable solutions for demanding applications in the Clock Drivers & Buffers category. With a fast propagation delay of just 0.6 ns, this surface-mount device offers differential mux input conditioning and operates at temperatures ranging from -40 °C to 85°C. Experience improved performance and precision timing in industrial settings with the MC100EP14DT, providing a valuable solution for your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to impact, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 0.6 ns

Low propagation delay ensures fast signal transmission, leading to efficient performance.

Surface Mount: YES

Surface mount packaging allows for easy and space-efficient integration onto circuit boards.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexing helps in reducing noise and improving signal integrity, enhancing overall system reliability.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage ensures consistent and stable operation of the clock driver.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable operation in various environmental conditions.

Technology: ECL

ECL technology provides high-speed performance and low power consumption, making the product suitable for demanding applications.

Technical Specifications

Clock Drivers & Buffers MC100EP14DT attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay At Nominal Supply:

.6 ns

Propagation Delay (tpd):

.45 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.045 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC100EP14DT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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