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MC100EP139DWR2G

Onsemi

MC100EP139DWR2G by Onsemi

MC100EP139DWR2G clock driver by Onsemi has 1.1ns propagation delay, operates at -40 to 85 °C, and supports up to 1500MHz fmax. Ideal for industrial applications requiring differential input conditioning and 3.3V nominal voltage.

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 2,989 parts In-Stock

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Digiode

USA . 779 parts In-Stock

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Bristol Electronics

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AZTECH Wire

Italy . 585 parts In-Stock

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$10.070

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$36.744

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$33.437

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$30.130

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SupplyDigital Components

Austria . 7,651 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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Corphita

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TANS Electronics

Latvia . 1,371 parts In-Stock

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UHIMA Technologies

Türkiye . 556 parts In-Stock

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Corohmni

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Microchip USA

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Overview

Enhance the performance of your electronic devices with the MC100EP139DWR2G clock driver and buffer by Onsemi. Crafted with precision using high-quality materials, this product offers unmatched reliability and efficiency. Ideal for various applications in the electronics industry, this clock driver ensures seamless operation and precise timing. Experience the value of advanced technology and innovation with Onsemi's MC100EP139DWR2G, providing customers with superior performance and peace of mind. Elevate your electronic projects to new heights with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability, making this product suitable for long-term use.

Propagation Delay At Nominal Supply: 1.1 ns

Low propagation delay ensures fast and efficient operation of the clock driver, improving overall system performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation onto PCBs, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps to reduce noise and improve signal integrity, resulting in more reliable clock signal transmission.

Nominal Supply Voltage / Vsup (V): 3.3

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the clock driver within specified parameters.

No. of True Outputs: 4

Having 4 true outputs allows for multiple clock signals to be distributed efficiently, making this product suitable for complex systems that require synchronization.

Technical Specifications

Clock Drivers & Buffers MC100EP139DWR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.0/-5.5/3.3/5.0

Propagation Delay At Nominal Supply:

1.1 ns

Propagation Delay (tpd):

.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Minimum fmax:

1500 MHz

Trade Compliance

MC100EP139DWR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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