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MC100EP11DTG

Onsemi

MC100EP11DTG by Onsemi

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

Median Price

$8.269

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 161 parts In-Stock

1+ parts

$9.110

100+ parts

$6.540

1k+ parts

$5.720

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161

$9.110

$6.540

$5.720

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DigiKey

USA . 315 parts In-Stock

1+ parts

$9.860

100+ parts

$6.546

1k+ parts

$5.950

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315

$9.860

$6.546

$5.950

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Verical

USA . 1,000 parts In-Stock

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$5.459

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$5.459

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Arrow

USA . 200 parts In-Stock

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$7.428

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$5.851

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200

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$7.428

$5.851

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Distributors (In-Stock)

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Digiode

USA . 350 parts In-Stock

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$10.773

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$10.773

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Vyrian

USA . 8,194 parts In-Stock

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Sensible Micro Corp

USA . 1,000 parts In-Stock

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Flip Electronics

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Chip Stock

USA . 625 parts In-Stock

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625

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TME

Poland . 200 parts In-Stock

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$9.220

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$9.220

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North Shore Components

USA . 164 parts In-Stock

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Zilex Electronics Inc.

Canada . 76 parts In-Stock

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Elcom Components

USA . 46 parts In-Stock

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Prism Electronics

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Semi Source

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Inventory MP

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Bristol Electronics

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 24 parts In-Stock

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$4.990

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24

$4.990

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Corohmni

South Africa . 281 parts In-Stock

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$6.962

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Corphita

USA . 533 parts In-Stock

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$10.206

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Microchip USA

USA . 959 parts In-Stock

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$30.660

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SupplyDigital Components

Austria . 8,373 parts In-Stock

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Kulean Microsystems

USA . 8,187 parts In-Stock

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TANS Electronics

Latvia . 7,336 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 412 parts In-Stock

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Problanco Electronics

Mexico . 142 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 23 parts In-Stock

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Technical Specifications

Clock Drivers & Buffers MC100EP11DTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE = -3.0V TO -5.5V

Family:

10EP

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.0/-5.5

Propagation Delay At Nominal Supply:

.32 ns

Propagation Delay (tpd):

.3 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.12 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100EP11DTG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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