Loading...

MC100E210FNR2G

Onsemi

MC100E210FNR2G by Onsemi

MC100E210FNR2G clock driver by Onsemi has 0.75 ns propagation delay at 5V, ECL technology, and 28 terminals. It is used for clock distribution in high-speed differential signal applications.

Median Price

$6.237

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$4.990

1k+ parts

$4.460

10k+ parts

$4.200

5,000

-

$4.990

$4.460

$4.200

DigiKey

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$6.560

1k+ parts

-

10k+ parts

-

5,000

-

$6.560

-

-

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$6.237

1k+ parts

$5.575

10k+ parts

$5.250

5,000

-

$6.237

$5.575

$5.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,726 parts In-Stock

1+ parts

$5.282

100+ parts

-

1k+ parts

-

10k+ parts

-

1,726

$5.282

-

-

-

Vyrian

USA . 4,991 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,991

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

856

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,166 parts In-Stock

1+ parts

$5.004

100+ parts

-

1k+ parts

-

10k+ parts

-

2,166

$5.004

-

-

-

Corohmni

South Africa . 345 parts In-Stock

1+ parts

$5.020

100+ parts

-

1k+ parts

-

10k+ parts

-

345

$5.020

-

-

-

Component Stockers USA

USA . 7,341 parts In-Stock

1+ parts

$5.670

100+ parts

$5.330

1k+ parts

$4.820

10k+ parts

-

7,341

$5.670

$5.330

$4.820

-

AZTECH Wire

Italy . 1,127 parts In-Stock

1+ parts

$18.290

100+ parts

-

1k+ parts

-

10k+ parts

-

1,127

$18.290

-

-

-

Kulean Microsystems

USA . 7,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,369

-

-

-

-

Microchip USA

USA . 6,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,549

-

-

-

-

Continental Prestige Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$4.730

1k+ parts

-

10k+ parts

-

5,000

-

$4.730

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 4,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,959

-

-

-

-

TANS Electronics

Latvia . 4,217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,217

-

-

-

-

SupplyDigital Components

Austria . 1,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,366

-

-

-

-

UHIMA Technologies

Türkiye . 892 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

892

-

-

-

-

Authorized Procurement Solutions

USA . 856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

856

-

-

-

-

Problanco Electronics

Mexico . 635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

635

-

-

-

-

Overview

Unleash the power of precision timing with the MC100E210FNR2G clock driver & buffer from Onsemi. Designed with top-quality materials and cutting-edge technology, this chip carrier package offers unmatched reliability and performance for a wide range of applications. Experience lightning-fast propagation delay, differential input conditioning, and a multitude of functions packed into one compact square shape. With a nominal supply voltage of 5V and a minimum operating temperature of 0 °C, this clock driver is the ideal choice for demanding electronic systems that require ultimate precision. Upgrade your designs today with the MC100E210FNR2G and see the difference in quality and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 0.75 ns

The low propagation delay ensures fast and efficient signal transmission, making this clock driver suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on PCBs, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and interference, improving the overall signal integrity of the clock driver.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making integration into existing systems straightforward.

Technology: ECL

The ECL technology offers high-speed operation and low power consumption, making this clock driver a reliable choice for demanding applications.

Technical Specifications

Clock Drivers & Buffers MC100E210FNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay At Nominal Supply:

.75 ns

Propagation Delay (tpd):

.75 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E210FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20