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KAI-04050-FBA-JB-B2-T

Onsemi

KAI-04050-FBA-JB-B2-T by Onsemi

KAI-04050-FBA-JB-B2-T by Onsemi is an image sensor with 5.5x5.5 um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 64 dB. Ideal for applications requiring high-resolution imaging in various industries.

Median Price

$389.714

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 352 parts In-Stock

1+ parts

$346.890

100+ parts

$326.080

1k+ parts

$305.260

10k+ parts

-

352

$346.890

$326.080

$305.260

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Verical

USA . 352 parts In-Stock

1+ parts

$432.538

100+ parts

$406.587

1k+ parts

-

10k+ parts

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352

$432.538

$406.587

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,416 parts In-Stock

1+ parts

$382.650

100+ parts

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2,416

$382.650

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Vyrian

USA . 7,348 parts In-Stock

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7,348

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,202 parts In-Stock

1+ parts

$21.600

100+ parts

-

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1,202

$21.600

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Corphita

USA . 1,234 parts In-Stock

1+ parts

$362.511

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-

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1,234

$362.511

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Corohmni

South Africa . 423 parts In-Stock

1+ parts

$402.790

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-

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423

$402.790

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

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15,000

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Problanco Electronics

Mexico . 8,366 parts In-Stock

1+ parts

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8,366

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Kulean Microsystems

USA . 3,571 parts In-Stock

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3,571

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TANS Electronics

Latvia . 1,503 parts In-Stock

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1,503

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UHIMA Technologies

Türkiye . 632 parts In-Stock

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632

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SupplyDigital Components

Austria . 483 parts In-Stock

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483

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Continental Prestige Electronics

USA . 352 parts In-Stock

1+ parts

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100+ parts

$341.910

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352

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$341.910

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Kepictronics

USA . 352 parts In-Stock

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352

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Overview

Capture life's moments with crystal-clear precision using the KAI-04050-FBA-JB-B2-T image sensor by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge technology in the field of image sensors. Ideal for applications in surveillance, automotive, and medical imaging, this sensor offers unmatched value and performance. With a wide operating temperature range and high dynamic range, customers can trust that their images will always be sharp and vibrant. Upgrade your imaging systems with the KAI-04050-FBA-JB-B2-T and experience the difference today.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Smaller pixel size allows for higher resolution and better image quality.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage provides flexibility in power source options.

Body Width: 20.07 inch

Compact body width makes it suitable for various devices and applications.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD type sensors are known for high-quality image capture and low noise.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for easy integration into different systems.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps in energy efficiency.

Maximum Operating Temperature: 70 °C

Wide operating temperature range enables use in various environments.

Horizontal Pixel: 2336

High horizontal pixel count results in detailed and clear images.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures functionality in extreme cold conditions.

Dynamic Range: 64 dB

Good dynamic range provides better contrast in images.

Vertical Pixel: 1752

High vertical pixel count contributes to overall image sharpness and clarity.

Body Length/Diameter: 33.02 mm

Compact body length/diameter allows for versatile installation options.

Termination Type: SOLDER

Solder termination ensures secure and reliable connection.

Array Type: INTERLINE

Interline array type offers fast readout and reduced image lag.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting simplifies the installation process.

Technical Specifications

Image Sensors KAI-04050-FBA-JB-B2-T attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

20.07 inch

Body Length/Diameter:

33.02 mm

Dynamic Range:

64 dB

Horizontal Pixel:

2336

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1752

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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