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KAI-02050-FBA-JD-BA

Onsemi

KAI-02050-FBA-JD-BA by Onsemi

KAI-02050-FBA-JD-BA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 64 dB. Ideal for applications requiring high-quality imaging in industrial or scientific settings.

Median Price

$1,927.250

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

$387.800

100+ parts

$364.530

1k+ parts

$341.260

10k+ parts

-

3

$387.800

$364.530

$341.260

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Arrow

USA . 18 parts In-Stock

1+ parts

$1,927.250

100+ parts

-

1k+ parts

-

10k+ parts

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18

$1,927.250

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-

-

Verical

USA . 18 parts In-Stock

1+ parts

$1,927.250

100+ parts

-

1k+ parts

-

10k+ parts

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18

$1,927.250

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 346 parts In-Stock

1+ parts

$364.012

100+ parts

-

1k+ parts

-

10k+ parts

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346

$364.012

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-

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Vyrian

USA . 4,941 parts In-Stock

1+ parts

-

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4,941

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 818 parts In-Stock

1+ parts

$12.720

100+ parts

-

1k+ parts

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818

$12.720

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-

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Corphita

USA . 316 parts In-Stock

1+ parts

$344.853

100+ parts

-

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316

$344.853

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-

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Corohmni

South Africa . 239 parts In-Stock

1+ parts

$383.170

100+ parts

-

1k+ parts

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239

$383.170

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Continental Prestige Electronics

USA . 3 parts In-Stock

1+ parts

$383.170

100+ parts

-

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3

$383.170

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Kulean Microsystems

USA . 5,858 parts In-Stock

1+ parts

-

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5,858

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SupplyDigital Components

Austria . 1,977 parts In-Stock

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1,977

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UHIMA Technologies

Türkiye . 897 parts In-Stock

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897

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TANS Electronics

Latvia . 726 parts In-Stock

1+ parts

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726

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Problanco Electronics

Mexico . 365 parts In-Stock

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365

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Overview

Capture stunning images with the KAI-02050-FBA-JD-BA image sensor by Onsemi. Renowned for their superior quality and cutting-edge technology, Onsemi delivers top-of-the-line image sensors for a wide range of applications. Whether you're in the field of security, surveillance, medical imaging, or industrial automation, this CCD image sensor offers unmatched performance and reliability. Elevate your projects with the KAI-02050-FBA-JD-BA and experience the benefits of crystal-clear image capture, high dynamic range, and precise details that will set you apart from the competition.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

With a smaller pixel size, this image sensor can capture more details and produce higher resolution images.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for better performance and faster processing of image data.

Body Width: 20.07 inch

The larger body width provides more room for additional features and functionalities within the sensor.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high image quality and low noise performance, making this a reliable choice for imaging applications.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for easy integration and mounting within camera systems.

Minimum Supply Voltage: 14.5 V

Even at lower supply voltage, this image sensor can still operate efficiently, making it versatile for different power requirements.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this image sensor can withstand harsh environments and extended use.

Horizontal Pixel: 1600

Higher horizontal pixel count allows for wider image capture and more detailed images.

Minimum Operating Temperature: -50 °C

The wide operating temperature range makes this image sensor suitable for use in extreme cold conditions.

Dynamic Range: 64 dB

A high dynamic range ensures that the sensor can capture both dark and bright areas accurately in the same image.

Vertical Pixel: 1200

Good vertical pixel count ensures better resolution and quality in vertical dimensions of the captured images.

Body Length/Diameter: 33.02 mm

The compact body length/diameter allows for easy integration and placement in various imaging systems.

Optical Format (inch): 2/3

A common optical format allows for compatibility with a wide range of lenses and accessories.

Termination Type: SOLDER

The solder termination type provides a reliable and secure connection for better performance and durability.

Array Type: INTERLINE

Interline array type enables faster readout speeds and improved image quality for moving objects or fast-paced scenes.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature ensures secure attachment to PCBs or camera systems, providing stability during operation.

Technical Specifications

Image Sensors KAI-02050-FBA-JD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

20.07 inch

Body Length/Diameter:

33.02 mm

Dynamic Range:

64 dB

Horizontal Pixel:

1600

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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