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FGHL50T65LQD

Onsemi

FGHL50T65LQD by Onsemi

FGHL50T65LQD by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.3V and a max IC of 80A, ideal for POWER CONTROL applications. It has a max VCE of 650V, operating temperature range from -55 to 175 °C, and comes in a RECTANGULAR package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,330 parts In-Stock

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Digiode

USA . 1,758 parts In-Stock

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1,758

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Native Components

USA . 459 parts In-Stock

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$0.408

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$0.392

459

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$0.392

Northwest PG Solutions

USA . 1,702 parts In-Stock

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$0.449

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$0.396

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$0.396

TANS Electronics

Latvia . 8,120 parts In-Stock

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SupplyDigital Components

Austria . 5,221 parts In-Stock

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Problanco Electronics

Mexico . 4,655 parts In-Stock

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Kulean Microsystems

USA . 4,037 parts In-Stock

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Corphita

USA . 1,446 parts In-Stock

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UHIMA Technologies

Türkiye . 835 parts In-Stock

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Corohmni

South Africa . 151 parts In-Stock

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Overview

Unlock the power of innovation with the FGHL50T65LQD by Onsemi, a cutting-edge Insulated Gate Bipolar Transistor (IGBT) designed to revolutionize power control applications. Manufactured by industry leader Onsemi, this N-CHANNEL transistor boasts unparalleled quality and reliability. Whether you're looking to enhance energy efficiency or optimize performance, this single configuration transistor with built-in diode offers unbeatable value. From its high power dissipation to its wide operating temperature range, the FGHL50T65LQD is the ultimate solution for your power control needs. Elevate your projects with Onsemi's FGHL50T65LQD and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the IGBT, ensuring reliable performance over time.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower ON-resistance and higher switching speeds compared to P-channel IGBTs, making them more efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against voltage spikes, enhancing the overall reliability of the IGBT.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and efficiency in controlling high power loads.

Maximum VCEsat: 1.3 V

Low VCEsat helps in minimizing power loss and improving the efficiency of the IGBT in power control applications.

Maximum Power Dissipation (Abs): 268 W

High power dissipation allows for handling large amounts of power without overheating, making it suitable for high-power applications.

Maximum Collector-Emitter Voltage: 650 V

High maximum collector-emitter voltage rating provides a wide range of applications in power electronics where higher voltage levels are required.

Maximum Gate-Emitter Voltage: 30 V

Higher gate-emitter voltage tolerance allows for reliable operation and precise control of the IGBT under various operating conditions.

Maximum Collector Current (IC): 80 A

High maximum collector current rating enables the IGBT to handle high current loads in power control applications.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage ensures efficient switching and control of the IGBT, reducing power losses during operation.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGHL50T65LQD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

30 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

1.3 V

Trade Compliance

FGHL50T65LQD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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